Add resets to eMMC/SD card blocks so linux can properly reset
them during initialization.
Signed-off-by: Alexey Minnekhanov <alexeymin@postmarketos.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250203063427.358327-4-alexeymin@postmarketos.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Swich to an OPP table for the UFS frequency scaling instead of
the deprecated freq-table-hz property.
The Operating Point table will also provide the associated
power domain level.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-10-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The QUP Serial Engines requires different power domain level
depending on their working frequency, add the required OPP
table with the level associated with all possible frequencies.
For the "I2C Hub" serial engines, sinse they only support a
single Operating Point, only add a single power domain level
property.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-9-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The PCIe bus interconnect path can be scaled depending on the
PCIe link established, add the OPP table with all the possible
link speeds and the associated power domain level.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-8-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
In all interconnect paths involving the cpu (MASTER_APPSS_PROC), use
the QCOM_ICC_TAG_ACTIVE_ONLY which will only retain the vote if
the CPU is online, leaving the firmware disabling the path when the
CPUs goes in suspend-idle.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-6-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The QUP Serial Engines requires different power domain level
depending on their working frequency, add the required OPP
table with the level associated with all possible frequencies.
For the "I2C Hub" serial engines, sinse they only support a
single Operating Point, only add a single power domain level
property.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-4-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The PCIe bus interconnect path can be scaled depending on the
PCIe link established, add the OPP table with all the possible
link speeds and the associated power domain level.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-3-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
In all interconnect paths involving the cpu (MASTER_APPSS_PROC), use
the QCOM_ICC_TAG_ACTIVE_ONLY which will only retain the vote if
the CPU is online, leaving the firmware disabling the path when the
CPUs goes in suspend-idle.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-2-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Use the proper QCOM_ICC_TAG_ define instead of passing 0 in all
interconnect paths phandle third argument.
Use QCOM_ICC_TAG_ALWAYS which is the fallback mask if 0 is used
as third phandle argument.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Acked-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250115-topic-sm8x50-upstream-dt-icc-update-v1-1-eaa8b10e2af7@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Configure the MDSS nodes for the phone and add the panel node.
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Reviewed-by: Marijn Suijten <marijn.suijten@somainline.org>
Link: https://lore.kernel.org/r/20250202-fp5-display-v1-1-f52bf546e38f@fairphone.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Configure the EEPROMs which are found on the different camera sensors on
this device.
The pull-up regulator for these I2C busses is vreg_cam_vio_1p8, the same
supply that powers VCC of all the EEPROMs.
Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>
Link: https://lore.kernel.org/r/20250203111429.22062-5-danila@jiaxyga.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Two regulators (GPIO 72 & 107) for the IMX766 sensor are missing here.
Without a driver, it's unclear if they're extra supplies or pwdn/power
GPIOs (labeled "custom" in the downstream kernel).
So add only those fixed regulators that are currently predictable for
camera sensors, camera EEPROMs and camera actuators.
Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>
Link: https://lore.kernel.org/r/20250203111429.22062-2-danila@jiaxyga.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Remove the remaining polling-delay-passive properties from
thermal nodes without a passive trip point.
Suggested-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20250203-topic-sm8650-thermal-cpu-idle-v4-4-65e35f307301@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
While the CPUs thermal is handled by the LMH, and GPU has a passive
cooldowm via the HLOS DCVS, all the other thermal blocks only have
hot and critical and no passive/active trip points.
Passive or active thermal management for those blocks should
be either defined if somehow we can express those in DT or
in the board definition if there's an active cooling device
available.
The tsens MAX_THRESHOLD is set to 120C on those platforms, so set
the hot to 110C to leave a chance to HLOS to react and critical to
115C to avoid the monitor thermal shutdown.
In the case a passive or active cooling device would be
available, the downstream reference implementation uses
the 95C "tj" trip point, as we already use for the
gpuss thermal blocks.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250203-topic-sm8650-thermal-cpu-idle-v4-3-65e35f307301@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
On the SM8650, the dynamic clock and voltage scaling (DCVS) for the GPU
is done from the HLOS, but the GPU can achieve a much higher temperature
before failing according the reference downstream implementation.
Set higher temperatures in the GPU trip points corresponding to
the temperatures provided by Qualcomm in the dowstream source, much
closer to the junction temperature and with a higher critical
temperature trip in the case the HLOS DCVS cannot handle the
temperature surge.
The tsens MAX_THRESHOLD is set to 120C on those platforms, so set
the hot to 110C to leave a chance to HLOS to react and critical to
115C to avoid the monitor thermal shutdown.
Fixes: 497624ed55 ("arm64: dts: qcom: sm8650: Throttle the GPU when overheating")
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250203-topic-sm8650-thermal-cpu-idle-v4-2-65e35f307301@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
On the SM8650, the dynamic clock and voltage scaling (DCVS) is done in an
hardware controlled loop using the LMH and EPSS blocks with constraints and
OPPs programmed in the board firmware.
Since the Hardware does a better job at maintaining the CPUs temperature
in an acceptable range by taking in account more parameters like the die
characteristics or other factory fused values, it makes no sense to try
and reproduce a similar set of constraints with the Linux cpufreq thermal
core.
In addition, the tsens IP is responsible for monitoring the temperature
across the SoC and the current settings will heavily trigger the tsens
UP/LOW interrupts if the CPU temperatures reaches the hardware thermal
constraints which are currently defined in the DT. And since the CPUs
are not hooked in the thermal trip points, the potential interrupts and
calculations are a waste of system resources.
Drop the current passive trip points and only leave the critical trip
point that will trigger a software system reboot before an hardware
thermal shutdown in the allmost impossible case the hardware DCVS cannot
handle the temperature surge.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Link: https://lore.kernel.org/r/20250203-topic-sm8650-thermal-cpu-idle-v4-1-65e35f307301@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The X1 family is split into two parts: the 10- and 12-core parts are
variants of the same silicon with different fusing, whereas the 8-core
ones are a separate design. Thankfully, the software interface is only
barely different, letting us reuse much of the existing X1 work.
Introduce support for the X1P42100 SoC and the CRD based on it, through
overlaying some bits. Everything we already support on X1E80100 and
friends, minus the GPU, should work as-is.
Tested-by: Jens Glathe <jens.glathe@oldschoolsolutions.biz>
Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250203-topic-x1p4_dts-v2-6-72cd4cdc767b@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Asserting the NOCSR reset line keeps the PHY registers in tact.
This allows us to avoid programming long tables of magic values in the
operating system.
Wire up these resets to PCIe PHY4 and 5 (it's there on the others).
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250203-topic-x1p4_dts-v2-4-72cd4cdc767b@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
IPQ5332 has tsens v2.3.3 peripheral. This patch adds the tsens
node with nvmem cells for calibration data.
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Manikanta Mylavarapu <quic_mmanikan@quicinc.com>
Link: https://lore.kernel.org/r/20250210120436.821684-4-quic_mmanikan@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add LDOA2 regulator from MP5496 to support SDCC voltage scaling.
Suggested-by: Robert Marko <robimarko@gmail.com>
Signed-off-by: Chukun Pan <amadeus@jmu.edu.cn>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250210070122.208842-6-amadeus@jmu.edu.cn
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Change the labels of mp5496 regulator from ipq6018 to mp5496.
Suggested-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Suggested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Chukun Pan <amadeus@jmu.edu.cn>
Link: https://lore.kernel.org/r/20250210070122.208842-5-amadeus@jmu.edu.cn
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Some IPQ60xx SoCs don't come with the mp5496 pmic chip. The mp5496
pmic was never part of the IPQ60xx SoC, it's optional, so we moved
it out of the soc dtsi.
Signed-off-by: Chukun Pan <amadeus@jmu.edu.cn>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20250210070122.208842-4-amadeus@jmu.edu.cn
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The early version of IPQ6000 (SoC id: IPQ6018, SBL version:
BOOT.XF.0.3-00077-IPQ60xxLZB-2) and IPQ6005 SoCs can reach
a max frequency of 1.5GHz, so add this CPU frequency.
Signed-off-by: Chukun Pan <amadeus@jmu.edu.cn>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Link: https://lore.kernel.org/r/20250210070122.208842-3-amadeus@jmu.edu.cn
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The final version of IPQ6000 (SoC id: IPQ6000, SBL version:
BOOT.XF.0.3-00086-IPQ60xxLZB-1) has a max design frequency
of 1.2GHz, so add this CPU frequency.
Signed-off-by: Chukun Pan <amadeus@jmu.edu.cn>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250210070122.208842-2-amadeus@jmu.edu.cn
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The sa8775p-ride platform uses the QCA6698 Bluetooth chip. While the
QCA6698 shares the same IP core as the WCN6855, it has different RF
components and RAM sizes, requiring new firmware files. Use the
firmware-name property to specify the NVM and rampatch firmware to load.
Signed-off-by: Cheng Jiang <quic_chejiang@quicinc.com>
Reviewed-by: Zijun Hu <quic_zijuhu@quicinc.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250110063914.28001-2-quic_chejiang@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Make this USB controller consistent with the others on this platform.
Fixes: 4af46b7bd6 ("arm64: dts: qcom: x1e80100: Add USB nodes")
Signed-off-by: Mark Kettenis <kettenis@openbsd.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250109205232.92336-1-kettenis@openbsd.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Enable SLPI, sensors DSP, on the Qualcomm Robotics RB5 platform. The
firmware for the DSP is a part of linux-firmware repository.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250222-rb3-rb5-slpi-v1-2-6739be1684b6@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Enable SLPI, sensors DSP, on the Qualcomm Robotics RB3 platform. The
firmware for the DSP is a part of linux-firmware repository.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250222-rb3-rb5-slpi-v1-1-6739be1684b6@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Enable PMIC and PMIC peripherals for qcs8300-ride board. The qcs8
300-ride uses 2 pmics(pmm8620au:0,pmm8650au:1) on the board, which
are variants of pmm8654au used on sa8775p/qcs9100 -ride(4x pmics).
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Tingguo Cheng <quic_tingguoc@quicinc.com>
Link: https://lore.kernel.org/r/20250108-adds-spmi-pmic-peripherals-for-qcs8300-v3-2-ee94642279ff@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add the PMU node for WCN6750 present on the qcs6490-rb3gen2
board and assign its power outputs to the Bluetooth module.
In WCN6750 module sw_ctrl and wifi-enable pins are handled
in the wifi controller firmware. Therefore, it is not required
to have those pins' entries in the PMU node.
Signed-off-by: Janaki Ramaiah Thota <quic_janathot@quicinc.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250221171014.120946-2-quic_janathot@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add the OPP tables for each CPU clusters (cpu0-1, cpu2-3-4, cpu5-6 & cpu7)
to permit scaling the Last Level Cache Controller (LLCC), DDR and L3 cache
frequency by aggregating bandwidth requests of all CPU core with referenc
to the current OPP they are configured in by the LMH/EPSS hardware.
The effect is a proper caches & DDR frequency scaling when CPU cores
changes frequency.
The OPP tables were built using the downstream memlat ddr, llcc & l3
tables for each cluster types with the actual EPSS cpufreq LUT tables
from running HDK and QRD devices.
The cpu2 and cpu5 tables are similar but must be kept separate to
take in account that they define OPP for shared CPUs of two different
clusters that can scale separately, thus vote different bandwidths.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20250211-topic-sm8650-ddr-bw-scaling-v2-3-a0c950540e68@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add the interconnect entry for each cpu, with 3 different paths:
- CPU to Last Level Cache Controller (LLCC)
- Last Level Cache Controller (LLCC) to DDR
- L3 Cache from CPU to DDR interface
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://lore.kernel.org/r/20250211-topic-sm8650-ddr-bw-scaling-v2-2-a0c950540e68@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The X Elite implements Server Base System Architecture (SBSA) specification
compliant generic watchdog.
Describe it.
Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20250212-x1e80100-add-watchdog-v2-1-a73897f0dad5@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add support for vadc and adc-tm channels which are used for
monitoring thermistors present on the platform.
- Add the necessary includes for qcom,spmi-adc7-pm7325 and
qcom,spmi-adc7-pmk8350.
- Add thermal zones for quiet-thermal, sdm-skin-thermal, and
xo-thermal, and define their polling delays and thermal sensors.
- Configure the pm7325_temp_alarm node to use the pmk8350_vadc
channel for thermal monitoring.
- Configure the pmk8350_adc_tm node to enable its thermal sensors
and define their registers and settings.
- Configure the pmk8350_vadc node to define its channels and settings
Signed-off-by: Rakesh Kota <quic_kotarake@quicinc.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250212113342.873086-1-quic_kotarake@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
There are 4 Qualcomm PMIC Die Temp Alarm Sensor Devices under windows os,
in separate dt files, pm8350c and pmr735a have already support temp alarm,
add the rest 2 devices for sc8280xp-pmic.
Temperature trip points are from dsdt(Temp. in tenths of degrees Kelvin).
example:
Name (TPSV, 0x0E60) // 0x0E60 - 2730 = 950
Method (_PSV, 0, NotSerialized) // _PSV: Passive Temperature
{
Return (\_SB.TZ15.TPSV)
}
Name (TCRT, 0x0F28) // 0X0F28 - 2730 = 1150
Method (_CRT, 0, NotSerialized) // _CRT: Critical Temperature
{
Return (\_SB.TZ15.TCRT)
}
Signed-off-by: Pengyu Luo <mitltlatltl@gmail.com>
Link: https://lore.kernel.org/r/20250111083209.262269-2-mitltlatltl@gmail.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
According to the binding for qcom,spmi-pmic-arb, the cell 1 should be
slave id, the slave id of pmc8280_2 is 3.
Signed-off-by: Pengyu Luo <mitltlatltl@gmail.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20250111083209.262269-1-mitltlatltl@gmail.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
