- Fix missing bitfield include headers in Armada and QCom SPM BMG
drivers (Daniel Lezcano)
- Fix missed file when manually applying a change after a conflict
resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)
- Move thermal_zone_device_enable() to the right place in order to
prevent calling it if the thermal zone registration failed (Dan
Carpenter)
- Improve bitfield manipulations on Armada (Bryan B. Lima)
- Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)
- Fix wrong boundary when clamping the low values in the set_trips()
callback and fix wrong mask when setting the temperature interval on
Airoha (Christian Marangi)
- Make use of the regmap API to support Airoha AN7583 (Christian
Marangi)
- Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
sensor (Rakesh Kota)
- Fix unbalanced clock enablement when the resume fails on the iMX
driver (Can Peng)
- Add Qualcomm Master BandGap thermal monitor support (Satya Priya
Kakitapalli)
- Add Maili Temperature bindings compatible (Haritha S K)
- Add a devm action to clean hardware interrupts, sampling, and
control registers on Spacemit K1 (Pei Xiao)
- Fix trivial typo in a thermal OF code comment (Marek Vasut)
- Remove unnecessary print on Qcom SPMI ADC driver when a call to
devm_request_threaded_irq() fails as this one already prints a
message (Jishnu Prakash)
- Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
shared interrupt with the IIO driver (Jishnu Prakash)
- Make resets optional on MT8196 and add the corresponding property in
the DT bindings (AngeloGioacchino Del Regno)
- Fix clock staying enabled on failing resume operation on Qoriq (Can
Peng)
- Fix wrong closing brace position in thermal library header (Andreas
Haufler)
- Fix low and high trip point validation by moving the check after the
clamp on the spacemit driver (surendra)
- Remove redundant error messages on IRQ request failure (Pan Chuang)
- Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
driver to avoid modpost warnings that would appear after merging the
iio tree against the thermal updates (Nathan Chancellor)
- Revert two recent cosmetic updates of the thermal core conflicting
with driver core plans to eliminate class_create() (Rafael Wysocki)
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Merge tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"This mostly consists of assorted updates of thermal drivers, including
new hardware support (Airoha AN7583, Qualcomm Master BandGap thermal
monitor, QCom PMIC5 Gen3 ADC), but it also includes two reverts of
recent cosmetic thermal core updates that went against driver core
plans to eliminate class_create():
- Fix missing bitfield include headers in Armada and QCom SPM BMG
drivers (Daniel Lezcano)
- Fix missed file when manually applying a change after a conflict
resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)
- Move thermal_zone_device_enable() to the right place in order to
prevent calling it if the thermal zone registration failed (Dan
Carpenter)
- Improve bitfield manipulations on Armada (Bryan B. Lima)
- Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)
- Fix wrong boundary when clamping the low values in the set_trips()
callback and fix wrong mask when setting the temperature interval
on Airoha (Christian Marangi)
- Make use of the regmap API to support Airoha AN7583 (Christian
Marangi)
- Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
sensor (Rakesh Kota)
- Fix unbalanced clock enablement when the resume fails on the iMX
driver (Can Peng)
- Add Qualcomm Master BandGap thermal monitor support (Satya Priya
Kakitapalli)
- Add Maili Temperature bindings compatible (Haritha S K)
- Add a devm action to clean hardware interrupts, sampling, and
control registers on Spacemit K1 (Pei Xiao)
- Fix trivial typo in a thermal OF code comment (Marek Vasut)
- Remove unnecessary print on Qcom SPMI ADC driver when a call to
devm_request_threaded_irq() fails as this one already prints a
message (Jishnu Prakash)
- Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
shared interrupt with the IIO driver (Jishnu Prakash)
- Make resets optional on MT8196 and add the corresponding property
in the DT bindings (AngeloGioacchino Del Regno)
- Fix clock staying enabled on failing resume operation on Qoriq (Can
Peng)
- Fix wrong closing brace position in thermal library header (Andreas
Haufler)
- Fix low and high trip point validation by moving the check after
the clamp on the spacemit driver (surendra)
- Remove redundant error messages on IRQ request failure (Pan Chuang)
- Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
driver to avoid modpost warnings that would appear after merging
the iio tree against the thermal updates (Nathan Chancellor)
- Revert two recent cosmetic updates of the thermal core conflicting
with driver core plans to eliminate class_create() (Rafael
Wysocki)"
* tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (32 commits)
thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER
Revert "thermal/core: Allocate the thermal class dynamically"
Revert "thermal/core: Use the thermal class pointer as init guard"
thermal/drivers/armada: Fix missing bitfields include
thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header
thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
thermal/drivers: Remove redundant error messages on IRQ request failure
thermal/drivers/spacemit: Validate clamped trip thresholds
tools/lib/thermal: Fix misplaced extern "C" closing brace
thermal/drivers/qoriq: Disable clock on resume failure
thermal/drivers/mediatek/lvts_thermal: Make reset optional for MT8196
dt-bindings: thermal: mediatek: Make resets optional for MT8196
thermal/drivers/qcom: add support for PMIC5 Gen3 ADC thermal monitoring
iio: adc: qcom-spmi-adc5-gen3: Share SDAM0 IRQ with ADC_TM auxiliary driver
iio: adc: qcom-spmi-adc5-gen3: Remove an unnecessary print
thermal/of: Fix trivial enabled typo
thermal/drivers/spacemit/k1: Add shutdown action and reorder registration order
dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
thermal/drivers/qcom: Add support for Qualcomm MBG thermal monitoring
dt-bindings: thermal: Add Qualcomm MBG thermal monitor support
...
- Add a DT maintainer profile document
- Various dt-check-style improvements
- Add a devres managed reserved memory region init function
- Print node name on any skipped reserved memory regions
- Correctly handle optional argument in of_parse_phandle_with_args_map()
- Convert ti,keystone-reset, ti,da850-vpif, TI L4 interconnect, TI
SmartReflex, microchip,pic32mzda-dmt, microchip,pic32mzda-wdt, TI
DA8XX MSTPRI bus, and Xen VM bindings to DT schema format
- Add bindings for StarFive JHB100 plic, Allwinner A733 NMI controller,
MediaTek MT8173 GPU, QCom Shikra, Eliza, and Maili cpu-bwmon, and QCom
Shikra SCM firmware
- A couple of syntax fixes found using PoC Rust implementation of
dtschema tools
- Clean-ups for typos, brackets, incorrect "::" usages, and
white-space style
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Merge tag 'devicetree-for-7.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Add a DT maintainer profile document
- Various dt-check-style improvements
- Add a devres managed reserved memory region init function
- Print node name on any skipped reserved memory regions
- Correctly handle optional argument in
of_parse_phandle_with_args_map()
- Convert ti,keystone-reset, ti,da850-vpif, TI L4 interconnect, TI
SmartReflex, microchip,pic32mzda-dmt, microchip,pic32mzda-wdt, TI
DA8XX MSTPRI bus, and Xen VM bindings to DT schema format
- Add bindings for StarFive JHB100 plic, Allwinner A733 NMI controller,
MediaTek MT8173 GPU, QCom Shikra, Eliza, and Maili cpu-bwmon, and
QCom Shikra SCM firmware
- A couple of syntax fixes found using PoC Rust implementation of
dtschema tools
- Clean-ups for typos, brackets, incorrect "::" usages, and
white-space style
* tag 'devicetree-for-7.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (40 commits)
dt-bindings: interconnect: qcom-bwmon: Add Maili cpu-bwmon compatible
dtc: dt-check-style: Simplify setting depth of DtsLine
dtc: dt-check-style: Add missing /dts-v1/ to few test cases
dt-bindings: power: reset: ti,keystone-reset: Convert to DT schema
media: dt-bindings: ti,da850-vpif: Convert to dt-schema
dt-bindings: devfreq: samsung,exynos-ppmu: Use standard regex syntax
dt-bindings: interrupt-controller: mediatek,mt6577-sysirq: Drop invalid JSON pointer
dt-bindings: arm: omap: Convert L4 interconnect to DT schema
dt-bindings: power: Convert TI SmartReflex to DT schema
of: reserved_mem: Introduce devres-managed initialization function
dt-bindings: interrupt-controller: Add StarFive JHB100 plic
dt-bindings: irq: sun7i-nmi: Document the Allwinner A733 NMI controller
dt-bindings: Correct white-space style
dt-bindings: fix typos and brackets
docs: dt: submitting-patches: Mention expectation about dt-check-style
docs: dt: maintainer: Add Devicetree and OF maintainer profile document
docs: dt: writing-schema: Extend expectations about example part of binding
dt-bindings: gpu: powervr-rogue: Add MediaTek MT8173 GPU
of: base: Handle optional argument in of_parse_phandle_with_args_map()
dt-bindings: update Sudeep Holla's email address
...
The SoC driver changes once more consist of many small fixes and
cleanups, that are to a large part the result of automated testing. On
platform specific drivers, this includes SoC specific code for xilinx,
freescale/nxp, qualcomm, TI, aspeed, omap, tegra, samsung, rockchip,
renesas, ixp4xx. In firmware drivers, we see a similar picture for
SCMI and qcomtee.
Aside from these, we see actual new hardware support in a few
areas:
- The Apple platform gets a new driver for low power states
- Updates to Qualcomm platform drivers add several new
hardware specific features and additional SoCs.
- Amlogic SoC support for A1 and T7 is added
- The Mediatek MMSYS driver is refactored as a cleanup.
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Merge tag 'soc-drivers-7.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull SoC driver updates from Arnd Bergmann:
"The SoC driver changes once more consist of many small fixes and
cleanups, that are to a large part the result of automated testing.
On platform specific drivers, this includes SoC specific code for
xilinx, freescale/nxp, qualcomm, TI, aspeed, omap, tegra, samsung,
rockchip, renesas, ixp4xx. In firmware drivers, we see a similar
picture for SCMI and qcomtee.
Aside from these, we see actual new hardware support in a few areas:
- The Apple platform gets a new driver for low power states
- Updates to Qualcomm platform drivers add several new hardware
specific features and additional SoCs.
- Amlogic SoC support for A1 and T7 is added
- The Mediatek MMSYS driver is refactored as a cleanup"
* tag 'soc-drivers-7.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (157 commits)
soc: qcom: make QCOM_PDR_MSG selectable
soc: qcom: ubwc: Fix missing include
soc: qcom: ubwc: Fix link error when QCOM_SMEM=n
media: iris: Guard the QCOM_UBWC_CONFIG select with QCOM_SMEM
drm/msm: Guard the QCOM_UBWC_CONFIG select with QCOM_SMEM
dt-bindings: arm: qcom,ids: Add SoC ID for Snapdragon SDM 850
firmware: xilinx: Clear firmware notifiers across kexec transitions
firmware: xilinx: Release all peripheral devices from firmware
firmware: xilinx: Add support to clear EL3 PM state
firmware: xilinx: Propagate actual error from feature check
firmware: xilinx: Use TF-A feature check for TF-A-specific APIs
bus: fsl-mc: drop unused assignment of acpi_device_id::driver_data
soc: fsl: qe: check platform_driver_register() in qe_ic_of_init()
phy: lynx-10g: use RCW override procedure for dynamic protocol change
soc: fsl: guts: implement the RCW override procedure
dt-bindings: fsl: layerscape-dcfg: define DCFG_DCSR region
soc: fsl: guts: make fsl_soc_data available after fsl_guts_init()
soc: fsl: guts: make it easier to determine on which SoC we are running
soc: fsl: guts: add a central fsl_guts_read() function
soc: fsl: guts: add a global structure to hold state
...
Convert the Texas Instruments OMAP L4 interconnect bus bindings
to DT schema.
During the conversion, several updates were made:
- Defined the compatible property as an array to require
the TI-specific string first, followed by either 'simple-bus' or
'simple-pm-bus'.
- Added a 'select' block to ensure this schema is only
applied to TI-specific nodes, preventing duplicate
schema warnings against the core simple-pm-bus.yaml.
- Added the L4 compatible strings used by the boards but missing from
the text binding, and corrected the 'ti,am3-l4-wkup' typo to
'ti,am33xx-l4-wkup'.
- Made 'reg' and 'reg-names' optional.
Signed-off-by: Eduard Bostina <egbostina@gmail.com>
Link: https://patch.msgid.link/20260810134051.380538-1-egbostina@gmail.com
[robh: move to bindings/bus/]
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
- Initial M3 Pro, Max and Ultra device trees, which are responsible for
the majority of the diffstat. These include CPU cores, interrupt
controller, power state, watchdog, serial pin/gpio controller, i2c and
the boot framebuffer. They are now on par with the base M3 device
trees.
- HWMON sensors for M1/M2
- "pmgr-misc" nodes for M1/2 Pro/Max/Ultra which saves about 1W of power
on these machines. The corresponding driver and dt-binding are part of
the Apple SoC driver changes tag for this cycle.
Signed-off-by: Sven Peter <sven@kernel.org>
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Merge tag 'apple-soc-dt-7.3' of https://git.kernel.org/pub/scm/linux/kernel/git/sven/linux into soc/dt
Apple SoC DTS changes for 7.3
- Initial M3 Pro, Max and Ultra device trees, which are responsible for
the majority of the diffstat. These include CPU cores, interrupt
controller, power state, watchdog, serial pin/gpio controller, i2c and
the boot framebuffer. They are now on par with the base M3 device
trees.
- HWMON sensors for M1/M2
- "pmgr-misc" nodes for M1/2 Pro/Max/Ultra which saves about 1W of power
on these machines. The corresponding driver and dt-binding are part of
the Apple SoC driver changes tag for this cycle.
Signed-off-by: Sven Peter <sven@kernel.org>
* tag 'apple-soc-dt-7.3' of https://git.kernel.org/pub/scm/linux/kernel/git/sven/linux: (22 commits)
arm64: dts: apple: Initial T6030 (M3 Pro) device trees
arm64: dts: apple: Initial T603[124] (M3 Max and Ultra) device trees
dt-bindings: pwm: apple,s5l-fpwm: Add t6030 and t6031 compatibles
dt-bindings: i2c: apple,i2c: Add t6030 and t6031 compatibles
dt-bindings: power: apple,pmgr-pwrstate: Add t6030 and t6031 compatibles
dt-bindings: arm: apple: apple,pmgr: Add t6030 and t6031 compatibles
dt-bindings: interrupt-controller: apple,aic2: Add apple,t6031-aic3 compatible
dt-bindings: interrupt-controller: apple,aic2: Invert #interrupt-cells condition
dt-bindings: arm: apple: Add M3 Pro/Max/Ultra devices (T603x)
arm64: dts: apple: t60xx: jxxx: Add device-specific SMC hwmon sensors
arm64: dts: apple: t8112: jxxx: Add device-specific SMC hwmon sensors
arm64: dts: apple: t8103: jxxx: Add device-specific SMC hwmon sensors
arm64: dts: apple: t602x: Add common SMC hwmon sensors
arm64: dts: apple: t600x: Add common SMC hwmon sensors
arm64: dts: apple: t8112: Add common SMC hwmon sensors
arm64: dts: apple: t8103: Add common SMC hwmon sensors
arm64: dts: apple: Add common SMC hwmon infrastructure
arm64: dts: apple: t602x: Add SMC hwmon node
arm64: dts: apple: t600x: Add SMC hwmon node
arm64: dts: apple: t8103: Add SMC hwmon node
...
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
This contains a few fixes for interrupt types and email addresses as
well as the addition of a compatible string for the Lenovo ThinkEdge
SE70 Edge Client.
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Merge tag 'tegra-for-7.3-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux into soc/dt
dt-bindings: Changes for v7.3-rc1
This contains a few fixes for interrupt types and email addresses as
well as the addition of a compatible string for the Lenovo ThinkEdge
SE70 Edge Client.
* tag 'tegra-for-7.3-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
dt-bindings: arm: tegra: Add lenovo,thinkedge-se70 compatible string
dt-bindings: gpu: host1x: Fix email address
dt-bindings: iommu: Fix interrupt type in example
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Orange Pi 5 Pro, Vicharak Axon, Vicharak Vaaman2, Youyeetoo YY3588
New peripherals: eDP support on RK3576
And of course a number of board-fixes, style-fixes and some newly
enabled board-components.
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Merge tag 'v7.3-rockchip-dts64-1' of https://git.kernel.org/pub/scm/linux/kernel/git/mmind/linux-rockchip into soc/dt
New boards: Graperain G3568, HINLINK H28K, LCKFB Taishan Pi 3M,
Orange Pi 5 Pro, Vicharak Axon, Vicharak Vaaman2, Youyeetoo YY3588
New peripherals: eDP support on RK3576
And of course a number of board-fixes, style-fixes and some newly
enabled board-components.
* tag 'v7.3-rockchip-dts64-1' of https://git.kernel.org/pub/scm/linux/kernel/git/mmind/linux-rockchip: (39 commits)
arm64: dts: rockchip: Fix rk3566-bigtreetech-cb2 touchscreen property
arm64: dts: rockchip: fix label of sys_led for nanopi-r4s
arm64: dts: rockchip: Fix the rk3566-radxa-cm3 Wifi compatible
arm64: dts: rockchip: Fix Gru WLAN sideband interrupt
arm64: dts: rockchip: Add Vicharak Vaaman2 board
dt-bindings: arm: rockchip: Add Vicharak Vaaman2
arm64: dts: rockchip: add Vicharak Axon board
dt-bindings: arm: rockchip: add Vicharak Axon board
arm64: dts: rockchip: Add LCKFB Taishan Pi 3M
dt-bindings: arm: rockchip: Add LCKFB Taishan Pi 3M
arm64: dts: rockchip: Add Orange Pi 5 Pro board support
arm64: dts: rockchip: refactor items from Orange Pi 5/b to prep for Pro
arm64: dts: rockchip: rename PLDO regulator labels to match schematic on rk3588s-orangepi-5
dt-bindings: arm: rockchip: Add Orange Pi 5 Pro
arm64: dts: rockchip: Add devicetree for the Graperain G3568 v2
dt-bindings: arm: rockchip: Add Graperain G3568 series
dt-bindings: vendor-prefixes: Add graperain
Revert "arm64: dts: rockchip: Further describe the WiFi for the Pinephone Pro"
arm64: dts: rockchip: fix HDMI-RX signal detect GPIO on yy3588
arm64: dts: rockchip: Enable USB device mode on rk3588s-roc-pc
...
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Introduce DeviceTree support for the Shikra SoC, its GCC and RPM clock
controllers, CQM, CQS, and IQS SoM platforms, and their evaluation boards.
Document the Hawi and Maili SoCs.
Add the Eliza CQS SoM and EVK platforms, the QCS8550 RB5 Gen 2, Vicharak
Axon Mini, HONOR MagicBook Art 14, Microsoft Surface Pro 12, Xiaomi 12 Lite,
Motorola Edge 30, Sony Xperia M2, and Motorola Moto G2 device trees.
Extend Eliza support with USB, SD card, touchscreen, PMIC, interconnect,
thermal, CPU and LLCC bandwidth-monitor, QUPv3, and ADSP GPR descriptions.
Expand Glymur support with GPU, camera and EVA clock controllers, LPASS
audio, CoreSight, PCIe, USB, IMEM and PIL memory regions, power domains,
thermal cooling, and CRD peripherals. Add SoCCP, PMIC regulator, TRNG, and
CPU-capacity descriptions.
Add display, IPA, camera, USB, audio, crypto, TRNG, CoreSight, and thermal
support to the Kaanapali, Milos, Hamoa, and related platforms. Add embedded
controller support for Hamoa and Glymur boards.
Improve networking-platform descriptions with IPQ PCIe port, PHY, clock,
PWM, regulator, and interrupt updates. Update CTCU, display, Iris, audio,
camera, PCIe, USB-C, power-domain, memory-region, and thermal descriptions
across established Qualcomm platforms.
Correct bindings and DeviceTree validation for Qualcomm compatible strings,
legacy fallback compatibles, node naming and formatting, address ranges,
clock specifiers, reserved memory, regulators, GPIOs, and peripheral wiring.
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Merge tag 'qcom-arm64-for-7.3' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/dt
Qualcomm Arm64 DeviceTree updates for v7.3
Introduce DeviceTree support for the Shikra SoC, its GCC and RPM clock
controllers, CQM, CQS, and IQS SoM platforms, and their evaluation boards.
Document the Hawi and Maili SoCs.
Add the Eliza CQS SoM and EVK platforms, the QCS8550 RB5 Gen 2, Vicharak
Axon Mini, HONOR MagicBook Art 14, Microsoft Surface Pro 12, Xiaomi 12 Lite,
Motorola Edge 30, Sony Xperia M2, and Motorola Moto G2 device trees.
Extend Eliza support with USB, SD card, touchscreen, PMIC, interconnect,
thermal, CPU and LLCC bandwidth-monitor, QUPv3, and ADSP GPR descriptions.
Expand Glymur support with GPU, camera and EVA clock controllers, LPASS
audio, CoreSight, PCIe, USB, IMEM and PIL memory regions, power domains,
thermal cooling, and CRD peripherals. Add SoCCP, PMIC regulator, TRNG, and
CPU-capacity descriptions.
Add display, IPA, camera, USB, audio, crypto, TRNG, CoreSight, and thermal
support to the Kaanapali, Milos, Hamoa, and related platforms. Add embedded
controller support for Hamoa and Glymur boards.
Improve networking-platform descriptions with IPQ PCIe port, PHY, clock,
PWM, regulator, and interrupt updates. Update CTCU, display, Iris, audio,
camera, PCIe, USB-C, power-domain, memory-region, and thermal descriptions
across established Qualcomm platforms.
Correct bindings and DeviceTree validation for Qualcomm compatible strings,
legacy fallback compatibles, node naming and formatting, address ranges,
clock specifiers, reserved memory, regulators, GPIOs, and peripheral wiring.
* tag 'qcom-arm64-for-7.3' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux: (244 commits)
arm64: dts: qcom: eliza: Describe the ADSP GPR node
arm64: dts: qcom: eliza-evk: Add support for USB and SD card
dt-bindings: arm: qcom-soc: Allow WSA88xx speaker compatible
dt-bindings: arm: qcom-soc: Validate nodes with fallbacks
dt-bindings: arm: qcom-soc: Document more of existing legacy style compatibles
dt-bindings: arm: qcom-soc: Include Eliza, Kaanapali and others in SoC names
arm64: dts: qcom: eliza: Enable cpufreq cooling devices
arm64: dts: qcom: glymur: add SoCCP DT node
arm64: dts: qcom: glymur: fix SoCCP memory mappings
arm64: dts: qcom: mahua: Add QREF regulator supplies to TCSR
arm64: dts: qcom: glymur: Add QREF regulator supplies to TCSR
arm64: dts: qcom: glymur: Add CX power domain to GCC
arm64: dts: qcom: glymur: Drop fake PCIe phy 3B
arm64: dts: qcom: glymur: add TRNG node
arm64: dts: qcom: glymur: enable ETR and CTCU devices
arm64: dts: qcom: glymur: Add PCIe port compatibles and ports
arm64: dts: qcom: smb2370: Disable SMB2370_2 by default
arm64: dts: qcom: eliza-mtp: Enable touchscreen
arm64: dts: qcom: purwa-iot-som: enable video
arm64: dts: qcom: purwa: Override Iris clocks and operating points
...
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Correct a few white-space issues, like double space after '=' or before
bracket '{' characters, which will be flagged by dt-check-style. No
functional changes.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Jeff Johnson <jjohnson@kernel.org> # qcom,ath10k.yaml
Acked-by: Suzuki K Poulose <suzuki.poulose@arm.com>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Uwe Kleine-König <ukleinek@kernel.org> # for Documentation/devicetree/bindings/pwm
Acked-by: Tomi Valkeinen <tomi.valkeinen@ideasonboard.com>
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Link: https://patch.msgid.link/20260801195613.235430-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Document the IMDT QCS8550 SBC which consists of an IMDT QCS8550 SoM
soldered onto an IMDT QCS8550 carrier board.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: William Bright <william.bright@imd-tec.com>
Link: https://lore.kernel.org/r/20260723-imdt-qcs8550-sbc-rfc-v5-2-2fb988854623@imd-tec.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
LincStation E1 is an entry-level NAS device powered by the RK3568B2 SoC
with two 3.5" HDD slots and two m.2 2280 slots for SSDs. It is marketed
under the LincPlus[1] brand, but the OEM appears to be Techvision
Intelligent Technology Co., Ltd[2]. The OEM model number is TVD8322R,
which is referenced by the vendor devicetree, a sticker on the board,
and a design patent (CN309443154S) matching the system chassis.
Link: https://www.lincplustech.com/products/lincstation-e1-network-attached-storage.html [1]
Link: https://cn.techvision.com.cn [2]
Signed-off-by: Samuel Holland <samuel@sholland.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260711192842.845048-4-samuel@sholland.org
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
The block on Apple M3 Pro, Max and Ultra SoCs is compatible with
"apple,t8103-pmgr". Add "apple,t6030-pmgr" and "apple,t6031-pmgr" as
per-SoC compatibles for M3 Pro and M3 Max and Ultra.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Janne Grunau <j@jannau.net>
Signed-off-by: Sven Peter <sven@kernel.org>
The M3 Pro, Max and Ultra Apple silicon SoC family (T6030, T6031, T6032
and T6034) differs from its M1 and M2 predecessors. Most notable is that
T6030 (M3 Pro) appears to be a separately designed SoC. MMIO address
spaces, interrupt and pin numbers do not match. It has two CPU clusters
with 6 efficiency or performance cores. T6031 (M3 Max) as one cluster
with 4 effciency cores and two clusters with 6 performance cores each.
T6032 (M3 Ultra) is like in the previous generations two T6031 dies
connected with an high speed interface and appears from operation system
perspective as a single SoC.
T6034 is a separate identifier for smaller M3 Max variant. It has fewer
performance CPU cores (10 instead of 12), fewer GPU cores (30 instead of
40) and less memory controllers (384-bit instead of 512-bit combined
width).
Apple has only released 14- and 16-inch Macbook Pros with T6030, T6031
and T6034 (M3 Pro and Max) and as only desktop device the Mac Studio
with T6032 (M3 Ultra).
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Janne Grunau <j@jannau.net>
Signed-off-by: Sven Peter <sven@kernel.org>
Lenovo ThinkEdge SE70 is a fanless industrial edge gateway carrier
board based on NVIDIA Tegra194 (Xavier NX) SOM.
Add the corresponding compatible string for device tree validation.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Jiqi Li <lijq9@lenovo.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
UX3607OA is a variant of the Asus Zenbook A16 built on the Qualcomm
Glymur platform. It comes with an 18-core X2 Elite Extreme SoC, 48GiB
of RAM, NVMe storage, a 2880 x 1800 OLED screen, and the other typical
Glymur platform capabilities.
The hardware wiring is very different versus the 14" SKU.
Add a compatible for this machine.
[1] https://www.asus.com/us/laptops/for-home/zenbook/asus-zenbook-a16-ux3607/techspec/
Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260721-topic-a16_submission-v1-1-8ea213130d05@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
One selects in this schema captures "^qcom,.*sa[0-9]+.*$" compatibles,
because there are SAxxxx Qualcomm SoCs. Unfortunately there is also
WSA8810 and WSA8855 I2C speakers, so they need listing too.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260721-dt-bindings-qcom-soc-naming-v3-4-8f275c9d3412@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The schema checking for expected naming patterns for SoC IP block nodes
was really incomplete and was checking only nodes with single
compatible.
Fix this by changing "select:" to "contains:" so every
node, except root nodes, having at least one matching compatible will be
evaluated.
This however will evaluate nodes which have some generic fallbacks (e.g.
syscon), thus the schema for expected compatible should also have
"contains:" (with "anyOf:").
These two above are the only functional changes in this commit and the
rest of the diff is indentation change. None of the patterns are
changed (neither in "Preferred naming style" group nor in "Legacy
namings"), none of the compatibles are affected. Basically the second
part of the diff is (simplifying):
properties:
compatible:
- oneOf:
- ......
+ contains:
+ anyOf:
+ ......
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260721-dt-bindings-qcom-soc-naming-v3-3-8f275c9d3412@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The schema misses several old style compatibles with SoC component
trailing in the compatible (qcom,IP-SoC):
- qcom,apss-wdt-x1e80100
- qcom,apss-wdt-xxx, qcom,rpm-xxx and qcom,scm-xxx for SoC with code
names (like qcom,rpm-shikra)
- qcom,kpss-gcc-xxx
- qcom,rpmcc-xxx
- qcom,tcsr-xxx
- qcom,usb-hs-phy-xxx
It also missed qcom,ipq806x-ahci.
None of these were flagged by schema, because they were used with
fallbacks and the schema checks only for single compatibles.
Nevertheless document them for complete picture and for future change,
which will apply the schema to fallbacks as well.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260721-dt-bindings-qcom-soc-naming-v3-2-8f275c9d3412@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Grow the schema checking for proper SoC compatible naming style with
recently upstreamed new Qualcomm SoCs: Eliza, Kaanapali, Hawi, Mahua,
Maili, Nord and Shikra. The list covers only SoC IP blocks, thus no
Hamoa or Talos in the names, because these are codenames but not used
for SoC IP block naming.
Since switching from model numbers to codenames, this list with explicit
codenames will have to grow and list them all in order for the schema to
work. It feels like a churn, but the compatible naming is still mess,
for example, the schema pci/qcom,pcie-x1e80100.yaml with a legacy naming
vendor,IP-SoC (qcom,pcie-x1e80100) received a new compatible with new
style (qcom,glymur-pcie).
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260721-dt-bindings-qcom-soc-naming-v3-1-8f275c9d3412@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add compatible string for the EmbedFire LubanCat 4 single board
computer based on the Rockchip RK3588S SoC.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Pufan Jin <2254650260@qq.com>
Link: https://patch.msgid.link/tencent_0DA92AE62C08A802ACC4FE9E47A0192C8E05@qq.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Add compatible string for the Anbernic RG Vita-Pro.
Signed-off-by: Chris Morgan <macromorgan@hotmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260728203832.166402-4-macroalpha82@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Add compatibles for the ArmSoM CM5, an RK3576 compute module, and its
CM5-IO carrier board.
Signed-off-by: Jiaxing Hu <gahing@gahingwoo.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260719034611.3623066-2-gahing@gahingwoo.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Document support for Airoha AN7583 chip-scu node.
This is similar to Airoha EN7581 with the addition of the presence of
thermal sensor in addition to controlling HW PIN and other miscellaneous
pheriperals.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260702094846.17325-7-ansuelsmth@gmail.com
Add device tree binding documentation for the Vicharak Vaaman2,
a single-board computer based on the Rockchip RK3588 SoC.
Signed-off-by: Hrushiraj Gandhi <hrushirajg23@gmail.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260714054653.266842-2-hrushirajg23@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Add the device tree binding for the Vicharak Axon single-board
computer based on the Rockchip RK3588 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Hrushiraj Gandhi <hrushirajg23@gmail.com>
Link: https://patch.msgid.link/20260608060940.52549-2-hrushirajg23@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Add compatible string for the Orange Pi 5 Pro.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Dennis Gilmore <dennis@ausil.us>
Link: https://patch.msgid.link/20260511025352.106126-2-dennis@ausil.us
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
TQMa91xxLA and TQMa91xxCA are two series of feature compatible SOM
using NXP i.MX91 SoC in 11x11 mm package.
MBa93xxCA is a starterkit base board usable for TQMa91xxCA and TQMa91xxLA
soldered on an adapter board to demonstrate use cases without display but
more interfaces.
Signed-off-by: Markus Niebel <Markus.Niebel@ew.tq-group.com>
Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Add DT compatible strings for Variscite VAR-SOM-MX8 QuadMax SoM and
Variscite Symphony development carrier Board.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Stefano Radaelli <stefano.r@variscite.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Add Hawi SoC and its reference boards to the Qualcomm binding.
Signed-off-by: Mukesh Ojha <mukesh.ojha@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260617151602.2018579-1-mukesh.ojha@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Document the Sony Xperia M2, which is a smartphone based on the
Qualcomm MSM8926 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Erikas Bitovtas <xerikasxx@gmail.com>
Link: https://lore.kernel.org/r/20260610-yukon-eagle-v4-1-763d5698bd2c@gmail.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Document the platforms that fallback to using the qcom,sa8775p-ctcu
compatible for probing.
Signed-off-by: Jie Gan <jie.gan@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Suzuki K Poulose <suzuki.poulose@arm.com>
Link: https://lore.kernel.org/r/20260204-enable-ctcu-and-etr-v3-1-0bb95c590ae1@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
The Vicharak Axon Mini is a single-board computer based on the
Qualcomm QCM6490 platform.
Add the top-level compatible string for this board.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Ajit Singh <blfizzyy@gmail.com>
Link: https://lore.kernel.org/r/20260624125443.18729-3-blfizzyy@gmail.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Shikra is a Qualcomm IoT SoC available in a System-on-Module (SoM)
form factor. The SoM integrates the Shikra SoC, PMICs, and essential
passives, and is designed to be mounted on carrier boards.
Three eSoM variant are introduced:
- CQM: retail variant with integrated modem (PM4125 and PM8005 PMIC)
- CQS: retail variant without modem (PM4125 and PM8005 PMIC)
- IQS: industrial-grade variant without modem (PM8150 PMIC)
Each SoM variant pairs with a common EVK carrier board provides debug
UART, USB, and other peripheral interfaces.
Add compatible strings for the CQ2390M, CQ2390S, IQ2390S SoM variant and
its corresponding EVK boards.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Komal Bajaj <komal.bajaj@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260612-shikra-dt-v6-1-6b6cb58db477@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Document the X1E-80-100 variant of the HONOR MagicBook Art 14.
Signed-off-by: Konstantin Shabanov <mail@etehtsea.me>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20260629154812.9066-3-mail@etehtsea.me
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Document the compatible strings for the Qualcomm Eliza CQS
System-on-Module (SoM) and its EVK board.
The SoM is populated with a CQ7790S Eliza variant, PMICs, LPDDR and
eMMC. The SoM is then connected to the EVK base board, which provides
a multitude of connectors for peripherals.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Abel Vesa <abel.vesa@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260630-eliza-dts-qcs-evk-v4-1-18cbbdba6e7e@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Add DT compatible strings for Variscite DART-MX8MM SoM and Variscite
development carrier Board.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Stefano Radaelli <stefano.r@variscite.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
