- Use devm_add_action_or_reset() for clock disable on the NVidia
soctherm and switch to devm cooling device registration version
(Daniel Lezcano)
- Replace the devm version implementation by the helper doing the same
thing (Daniel Lezcano)
- Add the Amlogic T7 thermal sensor along with thermal calibration
data read from SMC calls (Ronald Claveau)
- Fix typo in comment, "uppper" with "upper" in the TSens QCom driver
(Jinseok Kim)
- Add the QCom Shikra temperature sensor DT bindings (Gaurav Kohli)
- Add the QCom Hawi temperature sensor DT bindings (Dipa Ramesh Mantre)
- Fix atomic temperature read in the QCom tsens to comply with
hardware documentation (Priyansh Jain)
- Fix trailing whitespace and repeated word in the OF code. Do not
split quoted string across lines in the iMX7 driver (Mayur Kumar)
- Add SpacemiT K1 thermal sensor support (Shuwei Wu)
- Add the i.MX93 temperature sensor support and filter out the invalid
temperature (Jacky Bai)
- Enable by default the TMU (Thermal Monitoring Unit) on Exynos
platform (Krzysztof Kozlowski)
- Split the core code and the OF which are interleaved. Add the
cooling device per index registration in order to support dedicated
cooling devices controller (Daniel Lezcano)
- Add DT binding to specify an index in the cooling device map (Gaurav
Kohli)
- Rework interrupt initialization in the Tsens driver and add the
optional wakeup source (Priyansh Jain)
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Merge tag 'thermal-v7.2-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal driver updates for 7.2 from Daniel Lezcano:
- Add the QCom Nord temperature sensor DT bindings (Deepti Jaggi)
- Use devm_add_action_or_reset() for clock disable on the NVidia
soctherm and switch to devm cooling device registration version
(Daniel Lezcano)
- Replace the devm version implementation by the helper doing the same
thing (Daniel Lezcano)
- Add the Amlogic T7 thermal sensor along with thermal calibration
data read from SMC calls (Ronald Claveau)
- Fix typo in comment, "uppper" with "upper" in the TSens QCom driver
(Jinseok Kim)
- Add the QCom Shikra temperature sensor DT bindings (Gaurav Kohli)
- Add the QCom Hawi temperature sensor DT bindings (Dipa Ramesh Mantre)
- Fix atomic temperature read in the QCom tsens to comply with
hardware documentation (Priyansh Jain)
- Fix trailing whitespace and repeated word in the OF code. Do not
split quoted string across lines in the iMX7 driver (Mayur Kumar)
- Add SpacemiT K1 thermal sensor support (Shuwei Wu)
- Add the i.MX93 temperature sensor support and filter out the invalid
temperature (Jacky Bai)
- Enable by default the TMU (Thermal Monitoring Unit) on Exynos
platform (Krzysztof Kozlowski)
- Split the core code and the OF which are interleaved. Add the
cooling device per index registration in order to support dedicated
cooling devices controller (Daniel Lezcano)
- Add DT binding to specify an index in the cooling device map (Gaurav
Kohli)
- Rework interrupt initialization in the Tsens driver and add the
optional wakeup source (Priyansh Jain)"
* tag 'thermal-v7.2-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (34 commits)
thermal/drivers/qcom/tsens: Disable wakeup interrupt setup on automotive targets
thermal/drivers/qcom/tsens: Switch wake IRQ handling to PM callbacks
thermal/core: Fix missing stub for devm_thermal_cooling_device_register
dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device
thermal/of: Support cooling device ID in cooling-spec
thermal/of: Pass cdev_id and introduce devm registration helper
thermal/of: Add cooling device ID support
thermal/of: Rename the devm_thermal_of_cooling_device_register() function
thermal/core: Make cooling device OF node conditional on CONFIG_THERMAL_OF
thermal/of: Move cooling device OF helpers out of thermal core
hwmon: Use non-OF thermal cooling device registration API
thermal/core: Add devm_thermal_cooling_device_register()
thermal/core: Introduce non-OF thermal_cooling_device_register()
thermal/drivers/samsung: Enable TMU by default
thermal/driver/qoriq: Workaround unexpected temperature readings from tmu
thermal/drivers/qoriq: Add i.MX93 tmu support
dt-bindings: thermal: qoriq: Add compatible string for imx93
thermal/drivers/spacemit/k1: Add thermal sensor support
dt-bindings: thermal: Add SpacemiT K1 thermal sensor
thermal/drivers/imx: Do not split quoted string across lines
...
Add a no_irq_wake flag to struct tsens_plat_data to allow platforms
to control whether TSENS interrupts should be configured as wakeup
sources.
Create a new data_automotive structure and add compatible strings for
automotive TSENS variants (SA8775P, SA8255P) with wakeup interrupts
disabled.
Automotive platforms can enter a low-power parking suspend state where the
application processors and thermal mitigation paths are not active. In this
state, waking the system due to TSENS threshold interrupts does not enable
useful thermal action, but it does repeatedly break suspend residency and
increase battery drain.
Allow these automotive variants to keep TSENS monitoring enabled during
normal runtime while opting out of TSENS wakeup interrupts during suspend,
so the system can remain in low power until ignition/resume.
Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260601-tsens_interrupt_wake_control-v2-2-ce9570946abd@oss.qualcomm.com
This change improves power management by using the standardized PM
framework for wake IRQ handling.
Move wake IRQ control to the PM suspend/resume path:
- store uplow/critical IRQ numbers in struct tsens_priv
- enable wake IRQs in tsens_suspend_common() when wakeup is allowed
- disable wake IRQs in tsens_resume_common()
- mark the device wakeup-capable during probe
This aligns TSENS wake behavior with suspend flow and avoids keeping
wake IRQs permanently enabled during runtime.
Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260601-tsens_interrupt_wake_control-v2-1-ce9570946abd@oss.qualcomm.com
Extend the thermal cooling device binding to support a 3 cells specifier
along with the 2 cells format.
Update #cooling-cells property to enum to support both 2 and 3 arguments.
Fix pwm-fan.yaml to restrict the number of cells to 'const: 2'
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-22-daniel.lezcano@oss.qualcomm.com
Extend the cooling device specifier parsing to support an optional
cooling device identifier (cdev_id).
Two formats are now supported:
- Legacy format:
<&cdev lower upper>
- Indexed format:
<&cdev cdev_id lower upper>
When the indexed format is used, both the device node and the
cdev_id must match in order to bind a cooling device to a thermal
zone. The legacy format continues to match on the device node only,
preserving backward compatibility.
Update the parsing logic accordingly to handle both formats and
extract the mitigation limits from the appropriate arguments.
This is a preparatory step for upcoming DT bindings describing
cooling devices using (device node, id) tuples instead of child
nodes.
No functional change for existing device trees.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-21-daniel.lezcano@oss.qualcomm.com
Extend the OF cooling device registration to support an explicit
cooling device identifier (cdev_id), preparing for upcoming DT
bindings where cooling devices are identified by a tuple (device node,
id) instead of relying on child nodes.
Introduce a new helper:
devm_thermal_of_cooling_device_register()
which registers a cooling device using the device's of_node and an
explicit cdev_id. This complements the existing
devm_thermal_of_child_cooling_device_register() helper, which
remains dedicated to the legacy child-node based bindings.
Internally, factorize the devm registration logic into a common
helper to avoid code duplication.
Existing users are unaffected, as the child-based helper continues
to pass a default cdev_id of 0, preserving current behavior.
This change is a preparatory step for supporting indexed cooling
devices in thermal OF bindings.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-20-daniel.lezcano@oss.qualcomm.com
Introduce an identifier (cdev_id) for cooling devices registered from
device tree.
This prepares support for a new DT binding where cooling devices are
identified by a tuple (device node, ID), instead of relying on child
nodes.
Existing users are updated to pass a default ID of 0, preserving the
current behavior.
Future changes will extend the cooling map parsing to match cooling
devices based on both the device node and the ID.
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-19-daniel.lezcano@oss.qualcomm.com
To clarify that the function operates on child nodes, rename:
devm_thermal_of_cooling_device_register()
|
v
devm_thermal_of_child_cooling_device_register()
Used the command:
find . -type f -name '*.[ch]' -exec \
sed -i 's/devm_thermal_of_cooling_device_register/\
devm_thermal_of_child_cooling_device_register/g' {} \;
Did not used clang-format-diff because it does not indent correctly
and checkpatch complained. Manually reindented to make checkpatch
happy
This prepares for upcoming support of cooling devices identified by
an ID rather than device tree child nodes.
No functional change.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-18-daniel.lezcano@oss.qualcomm.com
The device node pointer stored in struct thermal_cooling_device is
only used by the OF-specific thermal code to associate cooling devices
with thermal zones defined in device tree.
Now that OF and non-OF registration paths are separated and non-OF
users no longer rely on devm_thermal_of_cooling_device_register() with
a NULL device node, the np field is no longer required for non-OF
configurations.
Make this field conditional on CONFIG_THERMAL_OF to reduce memory
footprint and better reflect its usage.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260526140802.1059293-16-daniel.lezcano@oss.qualcomm.com
The functions:
- thermal_of_cooling_device_register()
- devm_thermal_of_cooling_device_register()
are specific to device tree usage but are currently implemented in
thermal_core.c.
Move them to thermal_of.c to better reflect the separation between
generic thermal core code and OF-specific logic.
This change is enabled by the recent split of the cooling device
registration into allocation and addition phases, allowing OF-specific
handling (such as device node assignment) to be isolated from the core.
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-17-daniel.lezcano@oss.qualcomm.com
Some HWMON drivers register cooling devices using the OF helper
devm_thermal_of_cooling_device_register() with a NULL device node.
With the introduction of a dedicated non-OF registration API,
switch these users to devm_thermal_cooling_device_register()
to make the intent explicit and avoid relying on OF-specific helpers.
This is a pure refactoring with no functional change.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-15-daniel.lezcano@oss.qualcomm.com
Introduce a device-managed variant of the non-OF cooling device
registration API.
This complements devm_thermal_of_cooling_device_register() and allows
non-device-tree users to register cooling devices with automatic
cleanup tied to the device lifecycle.
The helper relies on devm_add_action_or_reset() to release the cooling
device via thermal_cooling_device_release() on driver detach or probe
failure.
This keeps the API consistent across OF and non-OF users and avoids
manual cleanup in error paths.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-14-daniel.lezcano@oss.qualcomm.com
Split the cooling device registration API into OF and non-OF variants.
Introduce thermal_cooling_device_register() for non-device-tree users
and rework thermal_of_cooling_device_register() to use the new
alloc/add split.
This removes the need for the internal __thermal_cooling_device_register()
helper and makes the separation between OF and non-OF users explicit.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-13-daniel.lezcano@oss.qualcomm.com
The SoC Thermal Management Unit (TMU) is essential for proper operation
of the SoCs. Kernel should not ask users choice of drivers when that
choice is obvious and known to the developers that answer should be
'yes' or 'module'.
Impact of making it default:
1. arm64 defconfig: No changes, already present in defconfig.
2. arm32: No changes, the driver is already selected by MACH_EXYNOS.
3. COMPILE_TEST builds: enable by default for arm32 or arm64 builds,
whenever ARCH_EXYNOS is selected. This has impact on build time and
feels logical, because if one selects ARCH_EXYNOS then probably by
default wants to build test it entirely. Kernels with COMPILE_TEST
are not supposed to be used for booting.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260526135312.8697-2-krzysztof.kozlowski@oss.qualcomm.com
Invalid temperature measurements may be observed across the temperature
range specified in the device data sheet. The invalid temperature can
be read from any remote site and from any capture or report registers.
The invalid change in temperature can be positive or negative and the
resulting temperature can be outside the calibrated range, in which
case the TSR[ORL] or TSR[ORH] bit will be set.
Workaround:
Use the raising/falling edge threshold to filter out the invalid temp.
Check the TIDR register to make sure no jump happens When reading the temp.
i.MX93 ERR052243:
(https://www.nxp.com/webapp/Download?colCode=IMX93_2P87F&appType=license)
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260430-imx93_tmu-v6-3-485459d7b54f@nxp.com
For Thermal monitor unit(TMU) used on i.MX93, the HW revision info read
from the ID register is the same the one used on some of the QorIQ
platform, but the config has some slight differance. Add i.MX93 compatible
string and corresponding code for it.
Signed-off-by: Alice Guo <alice.guo@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Frank Li <Frank.Li@nxp.com>
Link: https://patch.msgid.link/20260430-imx93_tmu-v6-2-485459d7b54f@nxp.com
Add i.MX93 compatible string 'fsl,imx93-tmu' because Thermal monitor
unit(TMU) on i.MX93 has differences with QorIQ platform and not fully
compatible with existing Platform, such as fsl,qoriq-tmu.
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Tested-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Reviewed-by: Frank Li <Frank.Li@nxp.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20260430-imx93_tmu-v6-1-485459d7b54f@nxp.com
The thermal sensor on K1 supports monitoring five temperature zones.
The driver registers these sensors with the thermal framework
and supports standard operations:
- Reading temperature (millidegree Celsius)
- Setting high/low thresholds for interrupts
Signed-off-by: Shuwei Wu <shuwei.wu@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Anand Moon <linux.amoon@gmail.com>
Reviewed-by: Troy Mitchell <troy.mitchell@linux.spacemit.com>
Reviewed-by: Yao Zi <me@ziyao.cc>
Tested-by: Anand Moon <linux.amoon@gmail.com>
Tested-by: Vincent Legoll <legoll@online.fr> # OrangePi-RV2
Tested-by: Gong Shuai <gsh517025@gmail.com>
Link: https://patch.msgid.link/20260427-k1-thermal-v5-2-df39187480ed@mailbox.org
Document the SpacemiT K1 Thermal Sensor, which supports
monitoring temperatures for five zones: soc, package, gpu, cluster0,
and cluster1.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Shuwei Wu <shuwei.wu@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.or>
Link: https://patch.msgid.link/20260427-k1-thermal-v5-1-df39187480ed@mailbox.org
The checkpatch tool warns against splitting quoted strings across
multiple lines. Join the dev_info message into a single line to
improve the ability to grep for the message in the source.
Signed-off-by: Mayur Kumar <kmayur809@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260511174255.215207-1-kmayur809@gmail.com
Correct a trailing whitespace error on line 101 and remove a
duplicated "which" in the kernel-doc comment for thermal_of_zone_register.
Signed-off-by: Mayur Kumar <kmayur809@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260511161854.193573-1-kmayur809@gmail.com
The existing TSENS temperature read logic polls the valid bit and then
reads the temperature register. When temperature reads are triggered
at very short intervals, this can race with hardware updates and allow
the temperature field to be read while it is still being updated.
In this case, the valid bit may already be asserted even though the
temperature value is transitioning, resulting in an incorrect reading.
Hardware programming guidelines require the temperature value and the
valid bit to be sampled atomically in the same read transaction. A
reading is considered valid only if the valid bit is observed set in
that same sample.
The guidelines further specify that software should attempt the
temperature read up to three times to account for transient update
windows. If none of the attempts yields a valid sample, a stable fallback
value must be returned: if the first and second samples match, the second
value is returned;otherwise, if the second and third samples match, the
third value is returned;if neither pair matches, -EAGAIN is returned.
Update the TSENS sensor read logic to implement atomic sampling along
with the recommended retry-and-compare fallback behavior. This removes
the race window and ensures deterministic temperature values in
accordance with hardware requirements.
Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://patch.msgid.link/20260514113643.1954111-1-priyansh.jain@oss.qualcomm.com
Document the Temperature Sensor (TSENS) on the Qualcomm Hawi SoC.
Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260512-dtbinding-hawi-v1-1-96149d06cccf@oss.qualcomm.com
Document the Temperature Sensor (TSENS) on the Shikra SoC.
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260513-tsens_binding-v1-1-1780c6a6caf2@oss.qualcomm.com
Fix a typo in the struct tsens_irq_data comment.
Replace "uppper" with "upper".
Signed-off-by: Jinseok Kim <always.starving0@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com>
Link: https://patch.msgid.link/20260516152324.1863-1-always.starving0@gmail.com
Some SoCs (e.g. T7) expose thermal calibration data through the secure
monitor rather than a directly accessible eFuse register. Add a use_sm
flag to amlogic_thermal_data to select this path, and retrieve the
firmware handle and tsensor_id from the "amlogic,secure-monitor" DT
phandle with one fixed argument.
Also introduce the amlogic,t7-thermal compatible using this new path.
While refactoring, fix a pre-existing bug where
amlogic_thermal_initialize() was called after
devm_thermal_of_zone_register(), causing the thermal framework to
read an uninitialized trim_info on zone registration.
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://patch.msgid.link/20260424-add-thermal-t7-vim4-v5-4-9040ca36afe2@aliel.fr
Add SM_THERMAL_CALIB_READ at SMC ID 0x82000047 in the command
table and implement meson_sm_get_thermal_calib(), which forwards the
tsensor_id argument to the secure monitor and returns the calibration data.
Also realign the CMD() column to improve readability.
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
[ dlezcano: Fixed kernel-doc format warning ]
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://patch.msgid.link/20260424-add-thermal-t7-vim4-v5-3-9040ca36afe2@aliel.fr
Add SM_THERMAL_CALIB_READ to the secure monitor command enum and
introduce meson_sm_get_thermal_calib() to allow drivers to retrieve
thermal sensor calibration data through the firmware interface.
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://patch.msgid.link/20260424-add-thermal-t7-vim4-v5-2-9040ca36afe2@aliel.fr
Add the amlogic,t7-thermal compatible for the Amlogic T7 thermal sensor.
Unlike existing variants which use a phandle to the ao-secure syscon,
the T7 relies on a secure monitor interface described by a phandle and
a sensor index argument.
The T7 integrates multiple thermal sensors, all accessed through the
same SMC call. The sensor index argument is required to identify which
sensor's calibration data the secure monitor should return, as a single
SM_THERMAL_CALIB_READ command serves all of them.
Introduce the amlogic,secure-monitor property as a phandle-array and
make amlogic,ao-secure or amlogic,secure-monitor conditionally required
depending on the compatible.
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260424-add-thermal-t7-vim4-v5-1-9040ca36afe2@aliel.fr
Use devm_add_action_or_reset() which does the replaced code. It
results in a simpler and more concise code.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260429161430.3802970-2-daniel.lezcano@oss.qualcomm.com
Use devm_thermal_of_cooling_device_register() to simplify resource
management and avoid manual cleanup in error paths.
As a side effect this change has the benefit of solving an existing
issue. Before, the function tegra_soctherm_remove() only called
debugfs_remove_recursive() and never called thermal_cooling_device_unregister()
for any of the cooling devices registered here.
After the driver removal, the thermal framework's cdev list would
still hold references to thermal_cooling_device objects whose devdata
pointer (ts) pointed to memory already freed by the platform device's
devm cleanup.
With this change, the cooling device is unregistered when the driver
is removed, thus fixing the issue above.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260424160019.41710-2-daniel.lezcano@oss.qualcomm.com
Replace the manual error handling paths disabling the clocks with
devm_add_action_or_reset(). This ensures the clocks are properly
disabled on probe failure and driver removal, while simplifying the
code by removing the explicit error paths.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260424160019.41710-1-daniel.lezcano@oss.qualcomm.com
Adjust white space in thermal_trip_of_attr().
Signed-off-by: Mayur Kumar <kmayur809@gmail.com>
[ rjw: Added changelog, added tabs before backslash ]
Link: https://patch.msgid.link/20260511175246.217788-1-kmayur809@gmail.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This continues the effort to refactor workqueue APIs, which began with
the introduction of new workqueues and a new alloc_workqueue flag in:
commit 128ea9f6cc ("workqueue: Add system_percpu_wq and system_dfl_wq")
commit 930c2ea566 ("workqueue: Add new WQ_PERCPU flag")
The refactoring is going to alter the default behavior of
alloc_workqueue() to be unbound by default.
With the introduction of the WQ_PERCPU flag (equivalent to !WQ_UNBOUND),
any alloc_workqueue() caller that doesn’t explicitly specify WQ_UNBOUND
must now use WQ_PERCPU. For more details see the Link tag below.
This workqueue has no benefits being per-CPU, so make it unbound adding
WQ_UNBOUND, removing also the WQ_POWER_EFFICIENT flag.
Link: https://lore.kernel.org/all/20250221112003.1dSuoGyc@linutronix.de/
Suggested-by: Tejun Heo <tj@kernel.org>
Signed-off-by: Marco Crivellari <marco.crivellari@suse.com>
[ rjw: Subject tweak ]
Link: https://patch.msgid.link/20260515084920.70544-1-marco.crivellari@suse.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since commit
13f4e660a1 ("thermal/core: Split __thermal_cooling_device_register()
into two functions")
thermal_cooling_device_setup_sysfs() is called before the
->get_max_state() callback in thermal_cooling_device_add().
However, cooling_device_stats_setup() allocates space based on
cdev->max_state, which is not initialized at that point.
With CONFIG_THERMAL_STATISTICS=y, an out of bounds access happens
inside thermal_cooling_device_stats_update(), followed by a kernel
crash:
Unable to handle kernel paging request at virtual address ffff800081329e60
Call trace:
queued_spin_lock_slowpath+0x1cc/0x320 (P)
thermal_cooling_device_stats_update+0x28/0xa4
__thermal_cdev_update+0x74/0x88
thermal_cdev_update+0x44/0x58
step_wise_manage+0x1b8/0x300
__thermal_zone_device_update+0x270/0x414
thermal_zone_device_check+0x28/0x40
process_one_work+0x150/0x290
worker_thread+0x18c/0x300
kthread+0x114/0x120
ret_from_fork+0x10/0x20
To fix this, restore the original ordering of ->get_max_state() and
thermal_cooling_device_setup_sysfs(). Note that with this reordering,
the dev_set_name() and ->get_max_state() error paths now reach
thermal_cdev_release() without setup_sysfs() having run. This is safe
because cdev->stats is NULL in that case and destroy_sysfs() is a no-op.
Fixes: 13f4e660a1 ("thermal/core: Split __thermal_cooling_device_register() into two functions")
Signed-off-by: Ovidiu Panait <ovidiu.panait.rb@renesas.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Link: https://patch.msgid.link/20260520165835.90974-1-ovidiu.panait.rb@renesas.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In preparation for the upcoming changes separating OF and non-OF code,
split __thermal_cooling_device_register() into allocation and addition
phases.
This allows moving the device node assignment out of the core
initialization path.
This change is not a trivial split. The lifetime of the cooling device
is managed by the device core through put_device(), which triggers
thermal_release() to free all associated resources.
With the introduction of thermal_cooling_device_alloc(), the allocation
path must mirror what thermal_release() undoes. In contrast,
thermal_cooling_device_add() must not perform any rollback and relies
on put_device() for cleanup on error paths. This avoids both double
free and resource leaks.
As part of this rework, add the missing device_initialize() call when
allocating the cooling device.
Suggested-by: Rafael J. Wysocki <rafael@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
[ rjw: Replace device_register() with device_add() ]
[ rjw: Rebase on top of previously applied material ]
Link: https://patch.msgid.link/20260505144447.2853933-1-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Instead of passing NULL as the last argument to __hwmon_device_register()
in hwmon_device_register_for_thermal() and then adding each temperature
sysfs attribute to the hwmon device via device_create_file(), redefine
hwmon_device_register_for_thermal() to take an extra_groups argument
that will be passed to __hwmon_device_register(), define an attribute
group with a proper .is_visible() callback for the temperature
attributes and a related attribute groups pointer, and pass the latter
to hwmon_device_register_for_thermal().
This causes the code to be way more straightforward and closer to
what the other users of the hwmon subsystem do.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/8704209.T7Z3S40VBb@rafael.j.wysocki
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The current code creates one hwmon device per thermal zone type and that
device is registered under the first thermal zone of the given type.
That turns out to be problematic when the thermal zone holding the
hwmon device is removed.
For example, say that there are two ACPI thermal zones on a system
/sys/devices/virtual/thermal/thermal_zone0/
/sys/devices/virtual/thermal/thermal_zone1/
The current code registers a hwmon class device for thermal_zone0 only:
/sys/devices/virtual/thermal/thermal_zone0/hwmon0/
because the type is "acpitz" for both of them, but it adds a sysfs
attribute that belongs to thermal_zone1 under it:
/sys/devices/virtual/thermal/thermal_zone0/hwmon0/temp2_input
There is also
/sys/devices/virtual/thermal/thermal_zone0/hwmon0/temp1_input
which belongs to thermal_zone0.
When thermal_zone0 is removed, say because the ACPI thermal driver is
unbound from the underlying platform device, the removal code skips the
removal of hwmon0 because of the temp2_input attribute belonging to
thermal_zone1 which effectively prevents thermal_zone0 removal from
making progress.
To address this problem, rework the thermal hwmon code to register one
hwmon device for each thermal zone, but since user space utilities
produce confusing output in some cases when there are multiple hwmon
devices with the same name attribute value present under thermal zones
of the same type, append the thermal zone ID preceded by an underline
character to the name of the hwmon device registered for that thermal
zone.
Link: https://lore.kernel.org/linux-pm/20260402021828.16556-1-liujia6264@gmail.com/
Fixes: f6b6b52ef7 ("thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/3070412.e9J7NaK4W3@rafael.j.wysocki
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since the return value of thermal_zone_crit_temp_valid() depends on
the behavior of the thermal zone .get_crit_temp() callback which
may change over time in theory, thermal_remove_hwmon_sysfs() may
attempt to remove a critical temperature attribute that has not
been created, passing a pointer to an uninitialized attribute
structure to device_remove_file().
To avoid that, set a flag in struct thermal_hwmon_temp after creating
a critical temperature attribute and use the value of that flag to
decide whether or not the attribute needs to be removed.
Fixes: e8db5d6736 ("thermal: hwmon: Make the check for critical temp valid consistent")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/2437056.ElGaqSPkdT@rafael.j.wysocki
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal class is now dynamically allocated and stored as a
pointer.
Use the thermal_class pointer itself to check whether the thermal
class has been created instead of keeping a separate
thermal_class_unavailable flag.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260508180511.1306659-5-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use class_create() instead of a statically allocated struct class.
This allows the thermal class to be managed through a dynamically
allocated class object and avoids keeping a static class instance
around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
[ rjw: Added __ro_after_init to thermal_class ]
[ rjw: Used temporary local var to store class_create() return value ]
Link: https://patch.msgid.link/20260508180511.1306659-4-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal class release callback currently handles thermal zone
cleanup by checking the device name prefix.
Move the thermal zone cleanup to a dedicated struct device release
callback. This avoids relying on device names to select the release
path and keeps the thermal zone lifetime handling local to the thermal
zone object.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260508180511.1306659-3-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal class release callback currently handles both thermal
zones and cooling devices by checking the device name prefix.
Move the cooling device cleanup to a dedicated struct device release
callback. This avoids relying on device names to select the release
path and keeps the cooling device lifetime handling local to the
cooling device object.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260508180511.1306659-2-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Thermal governors are only unregistered in the thermal_init() error
path and they actually are only deleted from thermal_governor_list.
Put the entire code needed to do that to thermal_unregister_governors()
and rearrange thermal_init() to call that function also when
thermal_register_governors() returns an error.
This allows thermal_unregister_governor() to be dropped
and thermal_register_governor() that is only called by
thermal_register_governors() can be made static __init, so the
headers of these two functions can be dropped from thermal_core.h.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/9615355.CDJkKcVGEf@rafael.j.wysocki
Since thermal_register_governor() is only called by
thermal_register_governors() which runs before clearing
thermal_class_unavailable, thermal_tz_list is guaranteed to be
empty when it runs, so the code walking that list in it is
effectively dead.
The same observation applies to the code walking thermal_tz_list
in thermal_unregister_governor() which is also called only if
thermal_class_unavailable hasn't been cleared.
Remove the dead code from both functions mentioned above and rearrange
thermal_register_governor() to reduce indentation level.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/3950489.kQq0lBPeGt@rafael.j.wysocki
