- Fix missing bitfield include headers in Armada and QCom SPM BMG
drivers (Daniel Lezcano)
- Fix missed file when manually applying a change after a conflict
resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)
- Move thermal_zone_device_enable() to the right place in order to
prevent calling it if the thermal zone registration failed (Dan
Carpenter)
- Improve bitfield manipulations on Armada (Bryan B. Lima)
- Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)
- Fix wrong boundary when clamping the low values in the set_trips()
callback and fix wrong mask when setting the temperature interval on
Airoha (Christian Marangi)
- Make use of the regmap API to support Airoha AN7583 (Christian
Marangi)
- Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
sensor (Rakesh Kota)
- Fix unbalanced clock enablement when the resume fails on the iMX
driver (Can Peng)
- Add Qualcomm Master BandGap thermal monitor support (Satya Priya
Kakitapalli)
- Add Maili Temperature bindings compatible (Haritha S K)
- Add a devm action to clean hardware interrupts, sampling, and
control registers on Spacemit K1 (Pei Xiao)
- Fix trivial typo in a thermal OF code comment (Marek Vasut)
- Remove unnecessary print on Qcom SPMI ADC driver when a call to
devm_request_threaded_irq() fails as this one already prints a
message (Jishnu Prakash)
- Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
shared interrupt with the IIO driver (Jishnu Prakash)
- Make resets optional on MT8196 and add the corresponding property in
the DT bindings (AngeloGioacchino Del Regno)
- Fix clock staying enabled on failing resume operation on Qoriq (Can
Peng)
- Fix wrong closing brace position in thermal library header (Andreas
Haufler)
- Fix low and high trip point validation by moving the check after the
clamp on the spacemit driver (surendra)
- Remove redundant error messages on IRQ request failure (Pan Chuang)
- Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
driver to avoid modpost warnings that would appear after merging the
iio tree against the thermal updates (Nathan Chancellor)
- Revert two recent cosmetic updates of the thermal core conflicting
with driver core plans to eliminate class_create() (Rafael Wysocki)
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Merge tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"This mostly consists of assorted updates of thermal drivers, including
new hardware support (Airoha AN7583, Qualcomm Master BandGap thermal
monitor, QCom PMIC5 Gen3 ADC), but it also includes two reverts of
recent cosmetic thermal core updates that went against driver core
plans to eliminate class_create():
- Fix missing bitfield include headers in Armada and QCom SPM BMG
drivers (Daniel Lezcano)
- Fix missed file when manually applying a change after a conflict
resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)
- Move thermal_zone_device_enable() to the right place in order to
prevent calling it if the thermal zone registration failed (Dan
Carpenter)
- Improve bitfield manipulations on Armada (Bryan B. Lima)
- Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)
- Fix wrong boundary when clamping the low values in the set_trips()
callback and fix wrong mask when setting the temperature interval
on Airoha (Christian Marangi)
- Make use of the regmap API to support Airoha AN7583 (Christian
Marangi)
- Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
sensor (Rakesh Kota)
- Fix unbalanced clock enablement when the resume fails on the iMX
driver (Can Peng)
- Add Qualcomm Master BandGap thermal monitor support (Satya Priya
Kakitapalli)
- Add Maili Temperature bindings compatible (Haritha S K)
- Add a devm action to clean hardware interrupts, sampling, and
control registers on Spacemit K1 (Pei Xiao)
- Fix trivial typo in a thermal OF code comment (Marek Vasut)
- Remove unnecessary print on Qcom SPMI ADC driver when a call to
devm_request_threaded_irq() fails as this one already prints a
message (Jishnu Prakash)
- Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
shared interrupt with the IIO driver (Jishnu Prakash)
- Make resets optional on MT8196 and add the corresponding property
in the DT bindings (AngeloGioacchino Del Regno)
- Fix clock staying enabled on failing resume operation on Qoriq (Can
Peng)
- Fix wrong closing brace position in thermal library header (Andreas
Haufler)
- Fix low and high trip point validation by moving the check after
the clamp on the spacemit driver (surendra)
- Remove redundant error messages on IRQ request failure (Pan Chuang)
- Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
driver to avoid modpost warnings that would appear after merging
the iio tree against the thermal updates (Nathan Chancellor)
- Revert two recent cosmetic updates of the thermal core conflicting
with driver core plans to eliminate class_create() (Rafael
Wysocki)"
* tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (32 commits)
thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER
Revert "thermal/core: Allocate the thermal class dynamically"
Revert "thermal/core: Use the thermal class pointer as init guard"
thermal/drivers/armada: Fix missing bitfields include
thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header
thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
thermal/drivers: Remove redundant error messages on IRQ request failure
thermal/drivers/spacemit: Validate clamped trip thresholds
tools/lib/thermal: Fix misplaced extern "C" closing brace
thermal/drivers/qoriq: Disable clock on resume failure
thermal/drivers/mediatek/lvts_thermal: Make reset optional for MT8196
dt-bindings: thermal: mediatek: Make resets optional for MT8196
thermal/drivers/qcom: add support for PMIC5 Gen3 ADC thermal monitoring
iio: adc: qcom-spmi-adc5-gen3: Share SDAM0 IRQ with ADC_TM auxiliary driver
iio: adc: qcom-spmi-adc5-gen3: Remove an unnecessary print
thermal/of: Fix trivial enabled typo
thermal/drivers/spacemit/k1: Add shutdown action and reorder registration order
dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
thermal/drivers/qcom: Add support for Qualcomm MBG thermal monitoring
dt-bindings: thermal: Add Qualcomm MBG thermal monitor support
...
This code accidentally calls thermal_zone_device_enable() before checking
whether thermal_zone_device_register_with_trips() failed. Move the call
until later to avoid an error pointer dereference of "priv->zone".
The driver works differently depending on if we are using OF thermal or
not. We use thermal_add_hwmon_sysfs() if we are using OF thermal and
call thermal_zone_device_enable() if not. We can share same error check
for if either of these fail.
Moving the thermal_zone_device_enable() call is a bit cleaner as well.
The original code used a three step process to cleanup:
1. Call thermal_zone_device_unregister() to cleanup.
2. Set priv->zone to an error pointer to preserve the error code.
3. Set priv->zone to NULL to avoid a second call to
thermal_zone_device_unregister() in the rcar_thermal_remove()
function.
Now we can just do a direct goto error_unregister and rcar_thermal_remove()
handles the cleanup properly.
Fixes: bbcf90c064 ("thermal: Explicitly enable non-changing thermal zone devices")
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/aj5WnseULiwgmlWv@stanley.mountain
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Merge tag 'v7.2-rc2' into togreg
Linux 7.2-rc2
Done to resolve conflicts with header reorg around mod_devicetable.h
and provide a base for other inflight series that touch the includes.
Use namespaced exports for IIO consumer API functions.
This will make it easier to manage the IIO export surface. Consumer drivers
will only be provided access to a specific set of functions, thereby
restricting usage of internal IIO functions by other parts of the kernel.
This change cannot be split into several parts without breaking
bisectability, thus all of the affected drivers are modified at once.
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com> # for power-supply
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@intel.com>
Signed-off-by: Romain Gantois <romain.gantois@bootlin.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Acked-by: Vinod Koul <vkoul@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Replace the #include of <linux/mod_devicetable.h> by the more specific
<linux/device-id/*.h> where applicable. For most cases the include
can be dropped completely, only a few drivers need one or two headers
added.
Acked-by: Danilo Krummrich <dakr@kernel.org>
Acked-by: Takashi Sakamoto <o-takashi@sakamocchi.jp>
Acked-by: Bjorn Helgaas <bhelgaas@google.com>
Link: https://patch.msgid.link/1a3f2007c5c5dcf555c09a4035ce3ae8ef1b6c49.1782808461.git.u.kleine-koenig@baylibre.com
Signed-off-by: Uwe Kleine-König (The Capable Hub) <u.kleine-koenig@baylibre.com>
The trim_offset field was removed from struct rzg3e_thermal_priv but
its kernel-doc entry was left behind. Remove it to fix the mismatch.
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260409125916.2244241-1-john.madieu.xa@bp.renesas.com
The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs expose the
temperature calibration via SMC SIP and do not have a reset for the
TSU peripheral, and use different minimum and maximum temperature values
compared to the already supported RZ/G3E.
Although the calibration data is stored in an OTP memory, the OTP itself
is not memory-mapped, access to it is done through an OTP controller.
The OTP controller is only accessible from the secure world,
but the temperature calibration data stored in the OTP is exposed via
SMC.
Add support for retrieving the calibration data using arm_smcc_smc().
Add a compatible for RZ/T2H, RZ/N2H can use it as a fallback.
Reviewed-by: John Madieu <john.madieu.xa@bp.renesas.com>
Tested-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://patch.msgid.link/20260108195223.193531-6-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs expose the
temperature calibration data via SMC SIP calls.
To prepare for supporting these SoCs, do the following changes.
Rename rzg3e_thermal_parse_dt() to rzg3e_thermal_get_syscon_trim().
Move the syscon usage out of rzg3e_thermal_get_calibration() and into
rzg3e_thermal_get_syscon_trim() and remove single-use variables from the
private state.
Place a pointer to rzg3e_thermal_get_syscon_trim() into the
chip-specific struct, and use it in the probe function to retrieve the
calibration values.
Now that syscon usage has been moved out of
rzg3e_thermal_get_calibration(), remove it and inline the calibration
validation into the probe function.
Also, reuse the TSU_CODE_MAX macro to mask the calibration values, as
GEMASK(11, 0) and 0xFFF are equivalent, and replace the hardcoded 0xFFF
with TSU_CODE_MAX in the calibration validation.
Reviewed-by: John Madieu <john.madieu.xa@bp.renesas.com>
Tested-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://patch.msgid.link/20260108195223.193531-4-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs have
different minimum and maximum temperatures compared to the already
supported RZ/G3E.
Prepare for them by moving these into a chip-specific struct.
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: John Madieu <john.madieu.xa@bp.renesas.com>
Tested-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Link: https://patch.msgid.link/20260108195223.193531-3-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs do not have a
reset line.
Prepare for them by making it optional.
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: John Madieu <john.madieu.xa@bp.renesas.com>
Tested-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Link: https://patch.msgid.link/20260108195223.193531-2-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the Renesas R-Car Gen3 thermal driver from SIMPLE_DEV_PM_OPS()
to DEFINE_SIMPLE_DEV_PM_OPS() and pm_sleep_ptr(). This lets us drop the
__maybe_unused annotation from its resume callback, and reduces kernel
size in case CONFIG_PM or CONFIG_PM_SLEEP is disabled.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://patch.msgid.link/813ad36fdc8561cf1c396230436e8ff3ff903a1f.1763117455.git.geert+renesas@glider.be
Convert the Renesas R-Car thermal driver from SIMPLE_DEV_PM_OPS() to
DEFINE_SIMPLE_DEV_PM_OPS() and pm_sleep_ptr(). This lets us drop the
check for CONFIG_PM_SLEEP, and reduces kernel size in case CONFIG_PM or
CONFIG_PM_SLEEP is disabled, while increasing build coverage.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://patch.msgid.link/ee03ec71d10fd589e7458fa1b0ada3d3c19dbb54.1763117351.git.geert+renesas@glider.be
The R-Car Gen3 thermal driver supports both R-Car Gen3 and Gen4 SoCs
as well as RZ/G2. Update the driver comment. No functional change.
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>
Link: https://patch.msgid.link/20251110143029.10940-1-marek.vasut+renesas@mailbox.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Restore sort order in MAINTAINERS and Kconfig,
- Remove empty trailing line from Makefile.
Fixes: 19d3a401a6 ("thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When applied the change commit 19d3a401a6, a conflict appeared
resulting into a manual fix. However the new file rzg3e_thermal.c was
not added but stayed locally in source tree and miss to be merged with
the entire change.
Fix this by adding the file back.
Fixes: 19d3a401a6 ("Add thermal driver for the Renesas RZ/G3E SoC")
Reported-by: kernel test robot <lkp@intel.com>
Closes: https://lore.kernel.org/oe-kbuild-all/202509272225.sARVqv2G-lkp@intel.com
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The RZ/G3E SoC integrates a Temperature Sensor Unit (TSU) block designed
to monitor the chip's junction temperature. This sensor is connected to
channel 1 of the APB port clock/reset and provides temperature measurements.
It also requires calibration values stored in the system controller registers
for accurate temperature measurement. Add a driver for the Renesas RZ/G3E TSU.
[ dlezcano: Fixed conflict with "renesas: Add support for RZ/G3S" ]
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20250917170202.197929-3-john.madieu.xa@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Renesas RZ/G3S SoC features a Thermal Sensor Unit (TSU) that reports
the junction temperature. The temperature is reported through a dedicated
ADC channel. Add a driver for the Renesas RZ/G3S TSU.
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20250810122125.792966-3-claudiu.beznea.uj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
S4 was added first so it was assumed to be the blueprint for R-Car Gen4.
It turned out now, that S4 is a special mix between Gen3 and Gen4. V4H
and V4M are the similar ones as confirmed by HW engineers.
So, rename the S4 entry to be specific instead of generic. Rename the
V4H entry to be the new generic one, so V4M will use it as well now.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20250911070254.2214-2-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The R-Car Gen3 thermal driver supports both R-Car Gen3 and Gen4 SoCs.
Update the Kconfig entry.
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20250905193322.148115-1-marek.vasut+renesas@mailbox.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Fix typo to millidegree Celsius. This aligns the comment with
another comment later on the same function. No functional change.
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>
Link: https://lore.kernel.org/r/20250907154148.171496-1-marek.vasut+renesas@mailbox.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add default trimming values for the four temperature sensors located
in Renesas R-Car V4H Working Sample SoC. The trimming values are
identical for all four THS temperature sensors.
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20250625181739.28391-2-marek.vasut+renesas@mailbox.org
The Working Sample R-Car SoCs may not yet have thermal sensor trimming
values programmed into fuses, those fuses are blank instead. For such
SoCs, the driver includes fallback trimming values. Those values are
currently applied to all SoCs which use this driver.
Introduce support for per-SoC fallback trimming values in preparation
for SoCs which do not use these current trimming values. No functional
change is intended here.
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20250625181739.28391-1-marek.vasut+renesas@mailbox.org
'struct thermal_zone_device_ops' are not modified in these drivers.
Constifying these structures moves some data to a read-only section, so
increases overall security, especially when the structure holds some
function pointers.
On a x86_64, with allmodconfig, as an example:
Before:
======
text data bss dec hex filename
28116 5168 128 33412 8284 drivers/thermal/armada_thermal.o
After:
=====
text data bss dec hex filename
28244 5040 128 33412 8284 drivers/thermal/armada_thermal.o
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Reviewed-by: Frank Li <Frank.Li@nxp.com>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # For Armada
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/5bba3bf0139e2418b306a0f9a2f1f81ef49e88a6.1748165978.git.christophe.jaillet@wanadoo.fr
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The hardware calibration is fused on some, but not all, Gen3 and Gen4
boards. The calibrations values are the same on both generations but
located at different register offsets.
Instead of having duplicated logic to read the and store the values
create structure to hold the register parameters and have a common
function do the reading.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20250305174631.4119374-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The style of the driver is to use lowercase hex constants, correct the
few outlines.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20250305174631.4119374-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
After commit 0edb555a65 ("platform: Make platform_driver::remove()
return void") .remove() is (again) the right callback to implement for
platform drivers.
Convert all platform drivers below drivers/thermal to use .remove(), with
the eventual goal to drop struct platform_driver::remove_new(). As
.remove() and .remove_new() have the same prototypes, conversion is done
by just changing the structure member name in the driver initializer.
On the way make a few whitespace changes to make indention consistent.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@baylibre.com>
Link: https://lore.kernel.org/r/20241019163412.304422-2-u.kleine-koenig@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
There is a extraneous space after a newline in a dev_err message.
Remove it.
Signed-off-by: Colin Ian King <colin.i.king@gmail.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20240901162719.144406-1-colin.i.king@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The only existing caller of thermal_zone_get_num_trips(), which is
rcar_gen3_thermal_probe(), uses this function to put the number of
trip points into a kernel log message, but this information is also
available from the thermal sysfs interface.
For this reason, remove the thermal_zone_get_num_trips() call from
rcar_gen3_thermal_probe() and drop the former altogether.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/2636988.Lt9SDvczpP@rjwysocki.net
Move all Renesas thermal drivers to a vendor specific directory.
All drivers are moved verbatim apart from the updated include path for
thermal_hwmon.h.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240506154011.344324-2-niklas.soderlund+renesas@ragnatech.se
