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a837468386
The HeYangTek HYF1GQ4UDACAE is a 1 Gbit (128 MiB) SLC SPI-NAND with 2048 + 64 byte pages and on-die 4-bit / 512-byte ECC; its JEDEC manufacturer ID is 0xc9. The die is GD5F1GQ4-compatible, so the OOB layout is taken from the in-tree gd5fxgq4xa. The die exposes only a coarse 2-bit ECC status with no fine-grained bitflip-count register, so the status is decoded into a representative number of corrected bitflips. It is found, among others, on some Keenetic KN-3411 (Buddy 6) units. Datasheet: https://www.heyangtek.cn/previewfile.jsp?file=ABUIABA9GAAgwsvRnwYo-eDpsgc Signed-off-by: Aleksei Sviridkin <f@lex.la> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
6 lines
286 B
Makefile
6 lines
286 B
Makefile
# SPDX-License-Identifier: GPL-2.0
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spinand-objs := core.o otp.o
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spinand-objs += alliancememory.o ato.o dosilicon.o esmt.o fmsh.o foresee.o gigadevice.o heyangtek.o
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spinand-objs += macronix.o micron.o paragon.o skyhigh.o toshiba.o winbond.o xtx.o
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obj-$(CONFIG_MTD_SPI_NAND) += spinand.o
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