The HeYangTek HYF1GQ4UDACAE is a 1 Gbit (128 MiB) SLC SPI-NAND with
2048 + 64 byte pages and on-die 4-bit / 512-byte ECC; its JEDEC
manufacturer ID is 0xc9. The die is GD5F1GQ4-compatible, so the OOB
layout is taken from the in-tree gd5fxgq4xa. The die exposes only a
coarse 2-bit ECC status with no fine-grained bitflip-count register, so
the status is decoded into a representative number of corrected bitflips.
It is found, among others, on some Keenetic KN-3411 (Buddy 6) units.
Datasheet:
https://www.heyangtek.cn/previewfile.jsp?file=ABUIABA9GAAgwsvRnwYo-eDpsgc
Signed-off-by: Aleksei Sviridkin <f@lex.la>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add support for Dosilicon DS35Q1GA (3.3V) and DS35M1GA (1.8V) SPI NAND.
These are 1Gbit (128MB) devices with:
- 2048 byte pages + 64 byte OOB
- 64 pages per block, 1024 blocks
- On-die 4-bit ECC per 512 byte sector
The 64-byte OOB area is divided into 4 segments of 16 bytes, with each
segment containing 8 bytes of user data (M2+M1) and 8 bytes of ECC
parity (R1). This provides 30 bytes of usable OOB space after reserving
2 bytes for the bad block marker.
Tested on Genexis Platinum 4410 (EcoNet EN751221) by writing known
patterns to OOB and verifying ECC parity placement in R1 regions.
Datasheet:
https://www.dosilicon.com/resources/SPI%20NAND/DS35X1GAXXX_rev08.pdf
Signed-off-by: Ahmed Naseef <naseefkm@gmail.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The MTD subsystem already supports accessing two OTP areas: user and
factory. User areas can be written by the user.
This patch provides the SPINAND_FACT_OTP_INFO and SPINAND_USER_OTP_INFO
macros to add parameters to spinand_info.
To implement OTP operations, the client (flash driver) is provided with
callbacks for user area:
.read(), .write(), .info(), .lock(), .erase();
and for factory area:
.read(), .info();
Signed-off-by: Martin Kurbanov <mmkurbanov@salutedevices.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
SkyHigh S35ML01G300, S35ML01G301, S35ML02G300, and S35ML04G300 are 1Gb,
2Gb, and 4Gb SLC SPI NAND flash family. This family of devices has
on-die ECC which parity bits are stored to hidden area. In this family
the on-die ECC cannot be disabled so raw access needs to be prevented.
Link: https://www.skyhighmemory.com/download/SPI_S35ML01_04G3_002_19205.pdf?v=P
Co-developed-by: KR Kim <kr.kim@skyhighmemory.com>
Signed-off-by: KR Kim <kr.kim@skyhighmemory.com>
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add minimal support for the MX35LF1GE4AB SPI NAND chip.
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add support for the W25M02GV chip.
Signed-off-by: Frieder Schrempf <frieder.schrempf@exceet.de>
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add a basic driver for Micron SPI NANDs. Only one device is supported
right now, but the driver will be extended to support more devices
afterwards.
Signed-off-by: Peter Pan <peterpandong@micron.com>
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add a SPI NAND framework based on the generic NAND framework and the
spi-mem infrastructure.
In its current state, this framework supports the following features:
- single/dual/quad IO modes
- on-die ECC
Signed-off-by: Peter Pan <peterpandong@micron.com>
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
