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dt-bindings: remoteproc: qcom,pas: add #cooling-cells property

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Document the optional #cooling-cells property for Qualcomm PAS
remoteproc nodes so they can be used as thermal cooling devices via
the QMI Thermal Mitigation Device (TMD) interface.

Qualcomm remote processors expose TMD endpoints that support thermal
throttling through firmware. The cooling-device specifier uses 3 cells:

  <&phandle device_id min_state max_state>

where device_id selects the TMD endpoint (for example PA, modem, or
CDSP software mitigation), with constants defined in:
include/dt-bindings/thermal/qcom,pas.h

Example usage in a thermal zone:

  cooling-maps {
      map0 {
          trip = <&cpu_alert>;
          cooling-device = <&remoteproc_cdsp
                           QCOM_TMD_CDSP_SW
                           0 THERMAL_NO_LIMIT>;
      };
  };

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260809-b4-qmi-tmd-v8-1-b15d47adc379@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
This commit is contained in:
Gaurav Kohli 2026-08-09 17:58:57 +05:30 committed by Bjorn Andersson
parent 2eb7702db3
commit 1a61afc42c
3 changed files with 30 additions and 0 deletions
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9
Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
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@ -77,6 +77,15 @@ properties:
channels and devices related to the ADSP.
unevaluatedProperties: false
'#cooling-cells':
description: |
Cooling device with three cells:
Cell 0: Cooling device id as defined in
include/dt-bindings/thermal/qcom,pas.h
Cell 1: Minimum cooling state
Cell 2: Maximum cooling state
const: 3
glink-edge:
$ref: /schemas/remoteproc/qcom,glink-edge.yaml#
description:

1
MAINTAINERS
View File

@ -3454,6 +3454,7 @@ F: drivers/watchdog/gunyah_wdt.c
F: include/dt-bindings/arm/qcom,ids.h
F: include/dt-bindings/firmware/qcom,scm.h
F: include/dt-bindings/soc/qcom*
F: include/dt-bindings/thermal/qcom,pas.h
F: include/linux/firmware/qcom
F: include/linux/soc/qcom/
F: include/soc/qcom/

20
include/dt-bindings/thermal/qcom,pas.h Normal file
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@ -0,0 +1,20 @@
/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
/*
* Qualcomm PAS remoteproc cooling device indices
*
* These indices are used in device tree cooling-maps to reference
* specific TMD devices provided by PAS-managed remote processors via QMI.
*
* Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
*/
#ifndef _DT_BINDINGS_THERMAL_QCOM_PAS_H
#define _DT_BINDINGS_THERMAL_QCOM_PAS_H
/* CDSP thermal mitigation device id */
#define QCOM_TMD_CDSP_SW 0
/* Modem thermal mitigation device id */
#define QCOM_TMD_PA 0
#define QCOM_TMD_MODEM 1
#endif /* _DT_BINDINGS_THERMAL_QCOM_PAS_H */