diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
index 11faf655f530..f75cab6b4ed9 100644
--- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
+++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
@@ -77,6 +77,15 @@ properties:
       channels and devices related to the ADSP.
     unevaluatedProperties: false
 
+  '#cooling-cells':
+    description: |
+      Cooling device with three cells:
+        Cell 0: Cooling device id as defined in
+                include/dt-bindings/thermal/qcom,pas.h
+        Cell 1: Minimum cooling state
+        Cell 2: Maximum cooling state
+    const: 3
+
   glink-edge:
     $ref: /schemas/remoteproc/qcom,glink-edge.yaml#
     description:
diff --git a/MAINTAINERS b/MAINTAINERS
index 3a19da74d00c..c5d45425abb5 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -3454,6 +3454,7 @@ F:	drivers/watchdog/gunyah_wdt.c
 F:	include/dt-bindings/arm/qcom,ids.h
 F:	include/dt-bindings/firmware/qcom,scm.h
 F:	include/dt-bindings/soc/qcom*
+F:	include/dt-bindings/thermal/qcom,pas.h
 F:	include/linux/firmware/qcom
 F:	include/linux/soc/qcom/
 F:	include/soc/qcom/
diff --git a/include/dt-bindings/thermal/qcom,pas.h b/include/dt-bindings/thermal/qcom,pas.h
new file mode 100644
index 000000000000..f603bddef9a8
--- /dev/null
+++ b/include/dt-bindings/thermal/qcom,pas.h
@@ -0,0 +1,20 @@
+/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
+/*
+ * Qualcomm PAS remoteproc cooling device indices
+ *
+ * These indices are used in device tree cooling-maps to reference
+ * specific TMD devices provided by PAS-managed remote processors via QMI.
+ *
+ * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
+ */
+#ifndef _DT_BINDINGS_THERMAL_QCOM_PAS_H
+#define _DT_BINDINGS_THERMAL_QCOM_PAS_H
+
+/* CDSP thermal mitigation device id */
+#define QCOM_TMD_CDSP_SW	0
+
+/* Modem thermal mitigation device id */
+#define QCOM_TMD_PA	0
+#define QCOM_TMD_MODEM	1
+
+#endif /* _DT_BINDINGS_THERMAL_QCOM_PAS_H */