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Some users still load bond module multiple times to create bonding
devices. This accidentally was broken by a later patch about
the time sysfs was fixed. According to Jay, it was broken
by:
commit
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|---|---|---|
| .. | ||
| bond_3ad.c | ||
| bond_3ad.h | ||
| bond_alb.c | ||
| bond_alb.h | ||
| bond_ipv6.c | ||
| bond_main.c | ||
| bond_sysfs.c | ||
| bonding.h | ||
| Makefile | ||