mirror of
https://github.com/torvalds/linux.git
synced 2026-09-23 22:14:03 +02:00
- Sunxi: Support added for the H616 compatible
- Qcom: Support added for the MDM9607 compatible
- Support for the Toshiba TC58NVG1S3H part
- GPMI: New debugfs entry to expose the chip geometry
- PL353: Timing updates and software ECC support have been fixed
* SPI NAND changes
- fmsh: Support added for FM25G{01,02}B chips
- HeYangTek: Support added for HYF1GQ4UDACAE
Aside from these main changes, there is the usual load of misc fixes and
hardening changes.
-----BEGIN PGP SIGNATURE-----
iQEzBAABCgAdFiEE9HuaYnbmDhq/XIDIJWrqGEe9VoQFAmp95DkACgkQJWrqGEe9
VoRS+Af+NoNZau3sf27YVygCQT+LWaRQgd1KN2ftk6fbaz+W/V2ZmC5lkSMPyOki
Yln3omlL84lRYIKjZEqq3jZ10V+EPb5x6qFx6uz4OSxvx8LzrQSYCDgMV2hCxNrg
gZSHuEBJb6gsmmACQdU2KqwyUmeVTWrky5+nrj8VPB7Fc1v+fiy63wb6fEWvrfgF
7tH2xZbfQLKuxMIHhli1mPr0Ij9gvUFHa7jNO3w8owv3MLj44xuEAzMmjp2cSqmx
JZGbxkRQMv2Z+kkSVAGkS49ogdZKJ4czabWbsG1BG+GiALFiuqZY1mh/d3wZ5q4f
omeMXnaW+roTjL+C9dewXihsT0PzVQ==
=8+Q/
-----END PGP SIGNATURE-----
Merge tag 'nand/for-7.3' into mtd/next
* Raw NAND changes
- Sunxi: Support added for the H616 compatible
- Qcom: Support added for the MDM9607 compatible
- Support for the Toshiba TC58NVG1S3H part
- GPMI: New debugfs entry to expose the chip geometry
- PL353: Timing updates and software ECC support have been fixed
* SPI NAND changes
- fmsh: Support added for FM25G{01,02}B chips
- HeYangTek: Support added for HYF1GQ4UDACAE
Aside from these main changes, there is the usual load of misc fixes and
hardening changes.
|
||
|---|---|---|
| .. | ||
| afs.c | ||
| bcm47xxpart.c | ||
| bcm63xxpart.c | ||
| brcm_u-boot.c | ||
| cmdlinepart.c | ||
| Kconfig | ||
| Makefile | ||
| ofpart_bcm4908.c | ||
| ofpart_bcm4908.h | ||
| ofpart_core.c | ||
| ofpart_linksys_ns.c | ||
| ofpart_linksys_ns.h | ||
| parser_imagetag.c | ||
| parser_trx.c | ||
| qcomsmempart.c | ||
| redboot.c | ||
| scpart.c | ||
| sharpslpart.c | ||
| tplink_safeloader.c | ||