mtdconcat finally makes it in, after several years of being merged and
reverted.
Baikal SoC support is being removed, so MTD bits are being removed as
well.
All the other changes are misc cleanups.
* NAND changes
The main changes happened in the SunXi driver in order to
support new versions of the Allwinner NAND controller.
There are also some DT-binding improvements and cleanups.
Finally a couple of actual fixes (Realtek ECC and Winbond SPI NAND),
aside with the usual load of misc changes.
* SPI NOR changes
There is only a collection of bugfixes this time around, with no notable
changes to the core. Some of the more noteworthy bugfixes listed below.
- Enable die erase on MT35XU02GCBA. We knew this flash needed this fixup
since 7f77c561e2 ("mtd: spi-nor: micron-st: add TODO for fixing
mt35xu02gcba") but did not add it due to lack of hardware to test on.
- Fix locking on some Winbond w25q series flashes.
- Fix Auto Address Increment (AAI) writes on SST that flashes that start
on odd address. The write enable latch needs to be set again after the
single byte program.
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Merge tag 'mtd/for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/mtd/linux
Pull MTD updates from Miquel Raynal:
"MTD changes:
- mtdconcat finally makes it in, after several years of being merged
and reverted
- Baikal SoC support is being removed, so MTD bits are being removed
as well
- misc cleanups
NAND changes:
- SunXi driver support for new versions of the Allwinner NAND
controller.
- DT-binding improvements and cleanups.
- A few fixes (Realtek ECC and Winbond SPI NAND), aside with the
usual load of misc changes.
SPI NOR fixes:
- Enable die erase on MT35XU02GCBA. We knew this flash needed this
fixup since 7f77c561e2 ("mtd: spi-nor: micron-st: add TODO for
fixing mt35xu02gcba") but did not add it due to lack of hardware to
test on.
- Fix locking on some Winbond w25q series flashes.
- Fix Auto Address Increment (AAI) writes on SST that flashes that
start on odd address. The write enable latch needs to be set again
after the single byte program"
* tag 'mtd/for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/mtd/linux: (44 commits)
mtd: spinand: winbond: Declare the QE bit on W25NxxJW
mtd: spi-nor: micron-st: Enable die erase support for MT35XU02GCBA
mtd: spi-nor: winbond: Fix locking support for w25q256jw
mtd: spi-nor: sst: Fix write enable before AAI sequence
mtd: spi-nor: winbond: Fix locking support for w25q64jvm
mtd: spi-nor: winbond: Fix locking support for w25q256jwm
dt-bindings: mtd: mxc-nand: add missing compatible string and ref to nand-controller-legacy.yaml
dt-bindings: mtd: gpmi-nand: ref to nand-controller-legacy.yaml
dt-bindings: mtd: refactor NAND bindings and add nand-controller-legacy.yaml
mtd: spinand: winbond: Clarify when to enable the HS bit
mtd: rawnand: sunxi: introduce maximize variable user data length
mtd: rawnand: sunxi: fix typos in comments
mtd: rawnand: sunxi: change error prone variable name
mtd: rawnand: sunxi: remove dead code
mtd: rawnand: sunxi: make the code more self-explanatory
mtd: rawnand: sunxi: replace hard coded value by a define - take2
mtd: rawnand: sunxi: do not count BBM bytes twice
mtd: rawnand: sunxi: fix sunxi_nfc_hw_ecc_read_extra_oob
mtd: rawnand: sunxi: sunxi_nand_ooblayout_free code clarification
mtd: cmdlinepart: use a flexible array member
...
support new versions of the Allwinner NAND controller.
There are also some DT-binding improvements and cleanups.
Finally a couple of actual fixes (Realtek ECC and Winbond SPI NAND),
aside with the usual load of misc changes.
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Merge tag 'nand/for-7.1' into mtd/next
The main changes happened in the SunXi driver in order to
support new versions of the Allwinner NAND controller.
There are also some DT-binding improvements and cleanups.
Finally a couple of actual fixes (Realtek ECC and Winbond SPI NAND),
aside with the usual load of misc changes.
Ref to nand-controller-legacy.yaml instead nand-controller.yaml to allow
legacy DT layout.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The modern NAND controller binding requires NAND chips to be described as
child nodes of the controller, for example:
nand-controller {
...
nand@0 {
/* raw NAND chip properties */
};
};
However, many existing device trees place NAND chip properties directly
within the controller node because those controllers support only a single
chip. This layout is still widely used by older platforms and by other DT
consumers such as U-Boot. Migrating all existing users to the new layout
will take time.
Several kernel drivers, such as ams-delta.c, davinci_nand.c and
fsmc_nand.c, still expect the legacy layout where raw NAND properties are
defined in the controller node.
To support both layouts during the transition:
- Extract NAND chip-related properties into separate schemas
(nand-property.yaml and raw-nand-property.yaml) from
nand-chip.yaml and raw-nand-chip.yaml.
- Introduce nand-controller-legacy.yaml to allow both the
legacy and modern layouts.
- Add a select condition in nand-controller.yaml to prevent
node name pattern matching for fsl,* NAND controllers.
Keep compatibility with existing device trees while allowing gradual
migration to the modern binding structure.
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Example is wrong, the reg property of the flash is always matching the
node name.
Fixes: 68cd8ef484 ("dt-bindings: mtd: st,spear600-smi: convert to DT schema")
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
These properties must be set because they overwrite the default values,
especially #size-cells which is 0 for most controllers and is 'const: 1'
here.
Fixes: 68cd8ef484 ("dt-bindings: mtd: st,spear600-smi: convert to DT schema")
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The description mixes two nodes. There is the controller, and there is
the flash. Describe the flash (which itself can be considered an mtd
device, unlike the top level controller), and move the st,smi-fast-mode
property inside, as this property is flash specific and should not live
in the parent controller node.
Fixes: 68cd8ef484 ("dt-bindings: mtd: st,spear600-smi: convert to DT schema")
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add compatible string fsl,imx25-nand and fsl,imx27-nand (over 15 years
chips). Add one optional clocks for it because i.MX25 and i.MX27 upstream
DTS defines them.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The AMD QSPI controller supports an advanced connection modes called
Stacked mode which allow the controller to treat two different flashes
as one storage.
In Stacked connection mode flashes share the same SPI bus, but different CS
line, controller driver asserts the CS of the flash to which it needs to
communicate. Stacked mode is a software abstraction rather than a
controller feature or capability. At any given time, the controller
communicates with one of the two connected flash devices, as determined by
the requested address and data length. If an operation starts on one flash
and ends on the other, the mtd layer needs to split it into two separate
operations and adjust the data length accordingly. For more information on
the modes please feel free to go through the controller flash interface
below [1].
To support stacked mode, the existing MTD concat driver has been extended
to be more generic, enabling multiple sets of MTD partitions to be
virtually concatenated, with each set forming a distinct logical MTD
device.
A new Device Tree property is introduced to facilitate this, containing
phandles of the partitions to be concatenated with the one where the
property is defined. This approach supports multiple sets of concatenated
partitions.
[1] https://docs.amd.com/r/en-US/am011-versal-acap-trm/QSPI-Flash-Device-Interface
Suggested-by: Miquel Raynal <miquel.raynal@bootlin.com>
Suggested-by: Rob Herring <robh@kernel.org>
Signed-off-by: Amit Kumar Mahapatra <amit.kumar-mahapatra@amd.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Luca Ceresoli <luca.ceresoli@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
- The major feature this release is the support for octal DTR
modes (8D-8D-8D).
- There has been as well a series of conversion to scoped for each OF
child loops.
- Support for Foresee F35SQB002G chips has been added.
Other changes are small fixes.
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Merge tag 'nand/for-7.0' into mtd/next
SPI NAND
- The major feature this release is the support for octal DTR
modes (8D-8D-8D).
- There has been as well a series of conversion to scoped for each OF
child loops.
- Support for Foresee F35SQB002G chips has been added.
Other changes are small fixes.
The Cadence HP NAND Flash Controller on supports DMA transactions through
a coherent interconnect. In previous generations SoC (Stratix10 and Agilex)
the interconnect was non-coherent, hence there is no need for dma-coherent
property to be presence. In Agilex 5, the architecture has changed. It
introduced a coherent interconnect that supports cache-coherent DMA.
Signed-off-by: Khairul Anuar Romli <khairul.anuar.romli@altera.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Several partition node bindings are just a compatible plus properties
defined in partition.yaml. Move all of these bindings to a single schema
file.
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Convert the brcm,trx partition binding to DT schema format.
As the "linksys,ns-firmware" compatible also uses "brcm,trx" as a
fallback, move it to the converted binding.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The fixed-partitions schema allowed undefined properties in order to
avoid warnings when there are nested fixed-partitions.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Partition nodes without a compatible have no restrictions on additional
properties. Fix this by ensuring 'unevaluatedProperties' is set when
there's no compatible property. If there is a compatible property, then
there should be a specific schema for it which will enforce
'unevaluatedProperties'.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The partitions.yaml schema is an unusual structure in that it includes
all possible partition types, and it disables the normal matching by
compatible strings. As partitions.yaml has nothing to match on, it is
only applied when explicitly referenced. The use of "oneOf" also results
in misleading warnings which are difficult to understand. Drop
partitions.yaml and rely on the standard compatible matching instead.
The "mmc-card" case previously allowed any partition type, but now only
allows "fixed-partitions". There aren't any users and the original
intent appeared to be only for "fixed-partitions".
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Whether "#address-cells" and "#size-cells" are used or not depends on
the specific partition type, so drop them from partitions.yaml and
define them in the specific partition schemas as needed.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
An "nvmem-layout" node can be used in any partition node, so add it.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Defining child node properties specific to the parent schema doesn't work
unless all the child node properties are known. They aren't known because
any partition can define its own properties. The solution to this is
typically something like spi-peripheral-props.yaml, but that's overkill for
this single property. Just move it to partition.yaml instead.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The "compression" property is defined in the wrong place as it applies
to individual partitions nodes, not all nodes.
Fixes: 8baba8d52f ("dt-bindings: mtd: fixed-partitions: Add compression property")
Reviewed-by: Simon Glass <simon.glass@canonical.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Some users of "brcm,nand-iproc" include "brcm,brcmnand" and some don't.
The "brcm,brcmnand" compatible is not useful for iProc systems as
there's a separate driver for iProc. So drop it as a fallback.
Reviewed-by: William Zhang <william.zhang@broadcom.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Convert Microchip 23K256 SPI SRAM MTD binding to YAML format.
Changes during conversion:
- Remove "address-cells" and "size-cells" from properties and
required sections as there is no child node for sram.
Signed-off-by: Akhila YS <akhilayalmati@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Convert NVIDIA Tegra NAND Flash Controller binding to YAML format.
Changes during Conversion:
- Define new properties `power-domains` and `operating-points-v2`
because the existing in tree DTS uses them.
- Modify MAINTAINERS references to point the created YAML file.
Signed-off-by: Charan Pedumuru <charan.pedumuru@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
My name is stamped into maintainership for a big slew of DT
bindings. Now that it is changing, switch it over to my
kernel.org mail address, which will hopefully be stable for the
rest of my life.
Signed-off-by: Linus Walleij <linusw@kernel.org>
Link: https://patch.msgid.link/20251216-maintainers-dt-v1-1-0b5ab102c9bb@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Three new SoCs got added in existing arm64 chip families:
- Renesas R-Car X5H (R8A78000) is a new generation of automotive SoCs,
based on 16 Cortex-A720 (Armv9.2) cores, which makes the the currently
highest-perforance embedded SoC.
- TI AM62L is a new variant of the AM62 family of industrial SoCs, this
one comes without a GPU.
- Qualcomm MSM8937 (Snapdragon 430) is an older mobile phone chip based
on Cortex-A53, and closely related to MSM8917 (Snapdragn 425), which we
already support.
In addition, there are a good number of newly supported machines
across SoC families:
- Two Aspeed AST2600 (Cortex-A7) based BMC setups for large servers
- Mobile Phones and tables based on Mediatek MT6582, Nvidia Tegra124,
Qualcomm MSM8937 and Qualcomm MSM8939,
- Two Laptops based on Qualcomm SoCs: one using the older sdm850, the
other using x1p42100.
- One Router based on Rockchips RK3568
- 24 variants of the Enclustra Mercury system-on-module, all based on
32-bit Intel/Altera SocFPGA chips, plus two boards using 64-bit
SocFPGA Agilex chips..
- 30 industrial/embedded boards and single-board computers, using
various chips from NXP, Rockchips, Mediatek, TI, Amlogic, Qualcomm,
Spacemit, and Starfive.
In total there are 783 commits here, the majority of these improving
hardware support and cleaning up devicetree files across the tree, with
the majority of the changes going into the Qualcomm, NXP, Renesas and
Rockchips platforms.
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Merge tag 'soc-dt-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull SoC devicetree updates from Arnd Bergmann:
"Three new SoCs got added in existing arm64 chip families:
- Renesas R-Car X5H (R8A78000) is a new generation of automotive
SoCs, based on 16 Cortex-A720 (Armv9.2) cores, which makes the the
currently highest-perforance embedded SoC.
- TI AM62L is a new variant of the AM62 family of industrial SoCs,
this one comes without a GPU.
- Qualcomm MSM8937 (Snapdragon 430) is an older mobile phone chip
based on Cortex-A53, and closely related to MSM8917 (Snapdragn
425), which we already support.
In addition, there are a good number of newly supported machines
across SoC families:
- Two Aspeed AST2600 (Cortex-A7) based BMC setups for large servers
- Mobile Phones and tables based on Mediatek MT6582, Nvidia Tegra124,
Qualcomm MSM8937 and Qualcomm MSM8939,
- Two Laptops based on Qualcomm SoCs: one using the older sdm850, the
other using x1p42100.
- One Router based on Rockchips RK3568
- 24 variants of the Enclustra Mercury system-on-module, all based on
32-bit Intel/Altera SocFPGA chips, plus two boards using 64-bit
SocFPGA Agilex chips..
- 30 industrial/embedded boards and single-board computers, using
various chips from NXP, Rockchips, Mediatek, TI, Amlogic, Qualcomm,
Spacemit, and Starfive.
In total there are 783 commits here, the majority of these improving
hardware support and cleaning up devicetree files across the tree,
with the majority of the changes going into the Qualcomm, NXP, Renesas
and Rockchips platforms"
* tag 'soc-dt-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (782 commits)
arm64: dts: mediatek: mt8195: Fix address range for JPEG decoder core 1
ARM: dts: samsung: exynos4412-midas: turn off SDIO WLAN chip during system suspend
ARM: dts: samsung: exynos4210-trats: turn off SDIO WLAN chip during system suspend
ARM: dts: samsung: exynos4210-i9100: turn off SDIO WLAN chip during system suspend
ARM: dts: samsung: universal_c210: turn off SDIO WLAN chip during system suspend
arm64: dts: amlogic: meson-g12b: Fix L2 cache reference for S922X CPUs
arm64: dts: Add gpio_intc node for Amlogic S7D SoCs
arm64: dts: Add gpio_intc node for Amlogic S7 SoCs
arm64: dts: Add gpio_intc node for Amlogic S6 SoCs
arm64: dts: amlogic: s7d: add ao secure node
arm64: dts: amlogic: s7: add ao secure node
arm64: dts: amlogic: s6: add ao secure node
arm64: dts: amlogic: Fix the register name of the 'DBI' region
dts: arm64: amlogic: add a5 pinctrl node
arm64: dts: amlogic: s7d: add power domain controller node
arm64: dts: amlogic: s7: add power domain controller node
arm64: dts: amlogic: s6: add power domain controller node
dts: arm64: amlogic: Add ISP related nodes for C3
arm64: dts: meson: add initial device-tree for Tanix TX9 Pro
dt-bindings: arm: amlogic: add support for Tanix TX9 Pro
...
DT bindings:
- Convert lattice,ice40-fpga-mgr, apm,xgene-storm-dma, brcm,sr-thermal,
amazon,al-thermal, brcm,ocotp, mt8173-mdp, Actions Owl SPS, Marvell
AP80x System Controller, Marvell CP110 System Controller,
cznic,moxtet, and apm,xgene-slimpro-mbox to DT schema format
- Add i.MX95 fsl,irqsteer, MT8365 Mali Bifrost GPU, Anvo ANV32C81W
EEPROM, and Microchip pic64gx PLIC
- Add missing LGE, AMD Seattle, and APM X-Gene SoC platform compatibles
- Updates to brcm,bcm2836-l1-intc, brcm,bcm2835-hvs, and bcm2711-hdmi
bindings to fix warnings on BCM2712 platforms
- Drop obsolete db8500-thermal.txt
- Treewide clean-up of extra blank lines and inconsistent quoting
- Ensure all .dtbo targets are applied to a base .dtb
- Speed up dt_binding_check by skipping running validation on empty
examples
DT core:
- Add of_machine_device_match() and of_machine_get_match_data() helpers
and convert users treewide
- Fix bounds checking of address properties in FDT code. Rework the code
to have a single implementation of the bounds checks.
- Rework of_irq_init() to ignore any implicit interrupt-parent (i.e. in
a parent node) on nodes without an interrupt. This matches the spec
description and fixes some RISC-V platforms.
- Avoid a spurious message on overlay removal
- Skip DT kunit tests on RISCV+ACPI
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Merge tag 'devicetree-for-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT bindings:
- Convert lattice,ice40-fpga-mgr, apm,xgene-storm-dma,
brcm,sr-thermal, amazon,al-thermal, brcm,ocotp, mt8173-mdp, Actions
Owl SPS, Marvell AP80x System Controller, Marvell CP110 System
Controller, cznic,moxtet, and apm,xgene-slimpro-mbox to DT schema
format
- Add i.MX95 fsl,irqsteer, MT8365 Mali Bifrost GPU, Anvo ANV32C81W
EEPROM, and Microchip pic64gx PLIC
- Add missing LGE, AMD Seattle, and APM X-Gene SoC platform
compatibles
- Updates to brcm,bcm2836-l1-intc, brcm,bcm2835-hvs, and bcm2711-hdmi
bindings to fix warnings on BCM2712 platforms
- Drop obsolete db8500-thermal.txt
- Treewide clean-up of extra blank lines and inconsistent quoting
- Ensure all .dtbo targets are applied to a base .dtb
- Speed up dt_binding_check by skipping running validation on empty
examples
DT core:
- Add of_machine_device_match() and of_machine_get_match_data()
helpers and convert users treewide
- Fix bounds checking of address properties in FDT code. Rework the
code to have a single implementation of the bounds checks.
- Rework of_irq_init() to ignore any implicit interrupt-parent (i.e.
in a parent node) on nodes without an interrupt. This matches the
spec description and fixes some RISC-V platforms.
- Avoid a spurious message on overlay removal
- Skip DT kunit tests on RISCV+ACPI"
* tag 'devicetree-for-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits)
dt-bindings: kbuild: Skip validating empty examples
dt-bindings: interrupt-controller: brcm,bcm2836-l1-intc: Drop interrupt-controller requirement
dt-bindings: display: Fix brcm,bcm2835-hvs bindings for BCM2712
dt-bindings: display: bcm2711-hdmi: Add interrupt details for BCM2712
of: Skip devicetree kunit tests when RISCV+ACPI doesn't populate root node
soc: tegra: Simplify with of_machine_device_match()
soc: qcom: ubwc: Simplify with of_machine_get_match_data()
powercap: dtpm: Simplify with of_machine_get_match_data()
platform: surface: Simplify with of_machine_get_match_data()
irqchip/atmel-aic: Simplify with of_machine_get_match_data()
firmware: qcom: scm: Simplify with of_machine_device_match()
cpuidle: big_little: Simplify with of_machine_device_match()
cpufreq: sun50i: Simplify with of_machine_device_match()
cpufreq: mediatek: Simplify with of_machine_get_match_data()
cpufreq: dt-platdev: Simplify with of_machine_get_match_data()
of: Add wrappers to match root node with OF device ID tables
dt-bindings: eeprom: at25: Add Anvo ANV32C81W
of/reserved_mem: Simplify the logic of __reserved_mem_alloc_size()
of/reserved_mem: Simplify the logic of fdt_scan_reserved_mem_reg_nodes()
of/reserved_mem: Simplify the logic of __reserved_mem_reserve_reg()
...
* The major change in this MR will be the support for the Allwinner H616
NAND controller, which lead to numerous changes and cleanups in the
driver.
* Another notable change on this driver is the use of
field_get()/field_prep(), but since the global support for this
helpers is going to be merged in the same release as we start using
these helpers, it implies undefining them in the first place to avoid
warnings. Depending on the merging order (Yuri's bitmap branch or
mtd/next), a temporary warning may arise.
* Marvell drivers layout handling changes have also landed, they fix
previous definitions and abuses that have been made previously, which
implied to relax the ECC parameters validation in the core a bit.
* The Cadence NAND controller driver gets NV-DDR interface support.
SPI NAND changes:
* Support for FudanMicro FM25S01BI3 and ESMT F50L1G41LC is added.
Aside from these main changes, there is the usual load of fixes and API
updates.
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Merge tag 'nand/for-6.19' into mtd/next
Raw NAND changes:
* The major change in this MR will be the support for the Allwinner H616
NAND controller, which lead to numerous changes and cleanups in the
driver.
* Another notable change on this driver is the use of
field_get()/field_prep(), but since the global support for this
helpers is going to be merged in the same release as we start using
these helpers, it implies undefining them in the first place to avoid
warnings. Depending on the merging order (Yuri's bitmap branch or
mtd/next), a temporary warning may arise.
* Marvell drivers layout handling changes have also landed, they fix
previous definitions and abuses that have been made previously, which
implied to relax the ECC parameters validation in the core a bit.
* The Cadence NAND controller driver gets NV-DDR interface support.
SPI NAND changes:
* Support for FudanMicro FM25S01BI3 and ESMT F50L1G41LC is added.
Aside from these main changes, there is the usual load of fixes and API
updates.
Generally at most 1 blank line is the standard style for DT schema
files. Remove the few cases with more than 1 so that the yamllint check
for this can be enabled.
Acked-by: Lee Jones <lee@kernel.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org> # remoteproc
Acked-by: Georgi Djakov <djakov@kernel.org>
Acked-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Acked-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org>
Acked-by: Jonathan Cameron <jonathan.cameron@huawei.com>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Uwe Kleine-König <ukleinek@kernel.org> # for allwinner,sun4i-a10-pwm.yaml
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # mtd
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Manivannan Sadhasivam <mani@kernel.org> # For PCI controller bindings
Link: https://patch.msgid.link/20251023143957.2899600-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
The H616 NAND controller is quite different from the A10 and A23 ones,
some registers offset changed, and some new one are introduced.
Also, the DMA handling is different (it uses chained descriptors)
So, introduce a new compatible to represent this version of the IP.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Richard Genoud <richard.genoud@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Physmap supports minimal PM since commit 0bc448b49e ("mtd: maps:
physmap: Add minimal Runtime PM support"), so support it also when used
in DT configurations.
Suggested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Agilex5 integrates an ARM SMMU (System Memory Management Unit) with
Translation Buffer Units (TBUs) assigned to various peripherals,
including the NAND controller.
The Cadence HP NAND controller ("cdns,hp-nfc") on Agilex5 is behind a
TBU connected to the system's SMMUv3. To support this, the controller
requires an `iommus` property in the device tree to properly configure
address translation through the IOMMU framework.
Adding the `iommus` property to the binding schema allows the OS
to associate the NAND controller with its corresponding SMMU stream ID.
This enables:
- DMA address translation between the controller and system memory
- Memory protection for NAND operations
- Proper functioning of the IOMMU framework in secure or virtualized
environments
This change documents the IOMMU integration for the NAND controller
on platforms like Agilex5 where such hardware is present.
Signed-off-by: Adrian Ng Ho Yin <adrianhoyin.ng@altera.com>
Signed-off-by: Khairul Anuar Romli <khairul.anuar.romli@altera.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dinh Nguyen <dinguyen@kernel.org>
Add a dtschema for the ECC engine on the Realtek RTL93xx SoCs.
The engine supports BCH6 and BCH12 parity for 512 byte blocks.
The hardware can make use of interrupts but this is not yet
supported by the driver. From the known datasheets it is
connected to the LXB (lexra bus) and propably depends on its
clock. Provide an optional clock property that can describe
the relation.
Signed-off-by: Markus Stockhausen <markus.stockhausen@gmx.de>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add new compatible for the Loongson-2K NAND controller used for
Loongson-2K1000 SoC.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Add new compatible for the Loongson-2K NAND controller used for
Loongson-2K0500 SoC.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Samsung S3C24xx family of SoCs was removed from the Linux kernel in the
commit 61b7f8920b ("ARM: s3c: remove all s3c24xx support"), in January
2023. There are no in-kernel users of its compatibles.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Apart from a binding conversion to yaml, only minor changes/small fixes
have been merged.
* Raw NAND changes:
Various controller drivers received minor fixes like DMA mapping checks,
better timing derivations or bitflip statistics.
It has also been discovered that some Hynix NAND flashes were not
supporting read-retries, which is not properly supported.
* SPI NAND changes:
In order to support high-speed modes, certain chips need extra
configuration like adding more dummy cycles. This is now possible,
especially on Winbond chips.
Aside from that, Gigadevice gets support for a new chip (GD5F1GM9).
* SPI NOR changes:
A notable changes is the fix for exiting 4-byte addressing on Infineon
SEMPER flashes. These flashes do not support the standard EX4B
opcode (E9h), and use a vendor-specific opcode (B8h) instead.
There is also a fix for unlocking flashes that are write-protected at
power-on. This was caused by using an uninitialized mtd_info in
spi_nor_try_unlock_all().
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Merge tag 'mtd/for-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/mtd/linux
Pull mtd updates from Miquel Raynal:
"MTD changes:
- Apart from a binding conversion to yaml, only minor changes/small
fixes have been merged.
Raw NAND changes:
- Minor fixes for various controller drivers like DMA mapping checks,
better timing derivations or bitflip statistics.
- some Hynix NAND flashes were not supporting read-retries, so don't
even try to do it
SPI NAND changes:
- In order to support high-speed modes, certain chips need extra
configuration like adding more dummy cycles. This is now possible,
especially on Winbond chips.
- Aside from that, Gigadevice gets support for a new chip (GD5F1GM9).
SPI NOR changes:
- A notable changes is the fix for exiting 4-byte addressing on
Infineon SEMPER flashes. These flashes do not support the standard
EX4B opcode (E9h), and use a vendor-specific opcode (B8h) instead.
- There is also a fix for unlocking flashes that are write-protected
at power-on. This was caused by using an uninitialized mtd_info in
spi_nor_try_unlock_all()"
* tag 'mtd/for-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/mtd/linux: (26 commits)
mtd: spinand: winbond: Add comment about the maximum frequency
mtd: spinand: winbond: Enable high-speed modes on w35n0xjw
mtd: spinand: winbond: Enable high-speed modes on w25n0xjw
mtd: spinand: Add a ->configure_chip() hook
mtd: spinand: Add a frequency field to all READ_FROM_CACHE variants
mtd: spinand: Fix macro alignment
spi: spi-mem: Take into account the actual maximum frequency
spi: spi-mem: Use picoseconds for calculating the op durations
mtd: rawnand: atmel: set pmecc data setup time
mtd: spinand: propagate spinand_wait() errors from spinand_write_page()
mtd: rawnand: fsmc: Add missing check after DMA map
mtd: rawnand: rockchip: Add missing check after DMA map
mtd: rawnand: hynix: don't try read-retry on SLC NANDs
mtd: rawnand: atmel: Fix dma_mapping_error() address
mtd: nand: brcmnand: fix mtd corrected bits stat
mtd: rawnand: renesas: Add missing check after DMA map
mtd: spinand: gigadevice: Add support for GD5F1GM9 chips
mtd: nand: brcmnand: replace manual string choices with standard helpers
mtd: map: Don't use "proxy" headers
mtd: spi-nor: Fix spi_nor_try_unlock_all()
...
Notable changes:
- Fix exiting 4-byte addressing on Infineon SEMPER flashes. These
flashes do not support the standard EX4B opcode (E9h), and use a
vendor-specific opcode (B8h) instead.
- Fix unlocking of flashes that are write-protected at power-on. This
was caused by using an uninitialized mtd_info in
spi_nor_try_unlock_all().
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Merge tag 'spi-nor/for-6.17' into mtd/next
SPI NOR changes for 6.17
Notable changes:
- Fix exiting 4-byte addressing on Infineon SEMPER flashes. These
flashes do not support the standard EX4B opcode (E9h), and use a
vendor-specific opcode (B8h) instead.
- Fix unlocking of flashes that are write-protected at power-on. This
was caused by using an uninitialized mtd_info in
spi_nor_try_unlock_all().
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.
No functional changes here, but saves some comments during reviews of
new patches built on existing code.
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Acked-by: Lee Jones <lee@kernel.org>
Acked-by: Thierry Reding <treding@nvidia.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> # renesas
Link: https://lore.kernel.org/r/20250107131456.247610-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250725100241.120106-2-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Convert nxp-spifi.txt to yaml format.
Additional changes:
- ref /schemas/spi/spi-controller.yaml.
- remove label in example.
- change node name to spi in example.
- remove child node in example.
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
equivalent of DDR transfers), which involved quite a few preparation
patches for clarifying macro names.
In the raw NAND subsystem, the brcmnand driver has been "fixed" for old
legacy SoCs with an update of the ->exec_op() hook, there has been the
introduction of a new controller driver named Loongson-1, and the
Qualcomm driver has received quite a few misc fixes as well as a new
compatible.
Aside from this, there is the usual load of misc improvement and fixes.
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Merge tag 'nand/for-6.16' into mtd/next
The SPI NAND subsystem has seen the introduction of DTR operations (the
equivalent of DDR transfers), which involved quite a few preparation
patches for clarifying macro names.
In the raw NAND subsystem, the brcmnand driver has been "fixed" for old
legacy SoCs with an update of the ->exec_op() hook, there has been the
introduction of a new controller driver named Loongson-1, and the
Qualcomm driver has received quite a few misc fixes as well as a new
compatible.
Aside from this, there is the usual load of misc improvement and fixes.
Add new compatible for the QPIC NAND controller v2.1.1 used for SDX75 SoC.
SDX75 NAND controller has iommu support so define it in the properties
section.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Kaushal Kumar <quic_kaushalk@quicinc.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Convert binding doc vf610-nfc to yaml format.
Additional changes:
- ref to nand-controller.yaml.
- include arm-gic.h and vf610-clock.h in examples.
- add clocks and clock-names description.
- remove #address-cells, #size-cells assigned-clocks and
assigned-clock-rates.
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
The atmel,dataflash binding has been converted to yaml and the physmap
one constrained. Some logs are improved, error path are getting reworked
a bit, few patches target the use of str_enabled_disabled().
* Raw NAND changes:
i.MX8 and i.MX31 now have their own compatible, the Qcom driver got
cleaned, the Broadcom driver got fixed.
* SPI NAND changes:
Two main features have been added:
- OTP support has been brought, and ESMT and Micron manufacturer drivers
implement it.
- Read retry, and Macronix manufacturer driver implement it.
* SPI NOR changes:
Adding support for few flashes. Few cleanup patches for the core
driver, where we touched the headers inclusion list and we start using
the scope based mutex cleanup helpers.
There is as well a bunch of minor improvements and fixes in drivers and
bindings.
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Merge tag 'mtd/for-6.15' of git://git.kernel.org/pub/scm/linux/kernel/git/mtd/linux
Pull mtd updates from Miquel Raynal:
"MTD changes:
- The atmel,dataflash binding has been converted to yaml and the
physmap one constrained. Some logs are improved, error path are
getting reworked a bit, few patches target the use of
str_enabled_disabled().
Raw NAND changes:
- i.MX8 and i.MX31 now have their own compatible, the Qcom driver got
cleaned, the Broadcom driver got fixed.
SPI NAND changes:
- OTP support has been brought, and ESMT and Micron manufacturer
drivers implement it.
- Read retry, and Macronix manufacturer driver implement it.
SPI NOR changes:
- Adding support for few flashes. Few cleanup patches for the core
driver, where we touched the headers inclusion list and we start
using the scope based mutex cleanup helpers.
There is also a bunch of minor improvements and fixes in drivers
and bindings"
* tag 'mtd/for-6.15' of git://git.kernel.org/pub/scm/linux/kernel/git/mtd/linux: (34 commits)
dt-bindings: mtd: atmel,dataflash: convert txt to yaml
mtd: mchp48l640: Use str_enable_disable() in mchp48l640_write_prepare()
mtd: rawnand: gpmi: Use str_enabled_disabled() in gpmi_nand_attach_chip()
mtd: mtdpart: Do not supply NULL to printf()
dt-bindings: mtd: gpmi-nand: Add compatible string for i.MX8 chips
mtd: nand: Fix a kdoc comment
mtd: spinand: Improve spinand_info macros style
mtd: spi-nor: drop unused <linux/of_platform.h>
mtd: spi-nor: explicitly include <linux/of.h>
mtd: spi-nor: explicitly include <linux/math64.h>
mtd: spi-nor: macronix: add support for mx66{l2, u1}g45g
mtd: spi-nor: macronix: Add post_sfdp fixups for Quad Input Page Program
mtd: Fix error handling in mtd_device_parse_register() error path
mtd: capture device name setting failure when adding mtd
mtd: Add check for devm_kcalloc()
mtd: Replace kcalloc() with devm_kcalloc()
dt-bindings: mtd: physmap: Ensure all properties are defined
mtd: rawnand: brcmnand: fix PM resume warning
dt-bindings: mtd: mxc-nand: Document fsl,imx31-nand
mtd: spinand: macronix: Add support for read retry
...
i.MX8 and i.MX31 now have their own compatible, the Qcom driver got
cleaned, the Broadcom driver got fixed.
* SPI NAND changes:
Two main features have been added:
- OTP support has been brought, and ESMT and Micron manufacturer drivers
implement it.
- Read retry, and Macronix manufacturer driver implement it.
There is as well a bunch of minor improvements and fixes in drivers and
bindings.
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Merge tag 'nand/for-6.15' into mtd/next
* Raw NAND changes:
i.MX8 and i.MX31 now have their own compatible, the Qcom driver got
cleaned, the Broadcom driver got fixed.
* SPI NAND changes:
Two main features have been added:
- OTP support has been brought, and ESMT and Micron manufacturer drivers
implement it.
- Read retry, and Macronix manufacturer driver implement it.
There is as well a bunch of minor improvements and fixes in drivers and
bindings.
