From 83f98a48f22c36bdbae0f5e07e07b26be44816eb Mon Sep 17 00:00:00 2001 From: Haritha S K Date: Fri, 19 Jun 2026 15:50:59 +0530 Subject: [PATCH] dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor Document the Temperature Sensor (TSENS) on the Qualcomm Maili SoC. Acked-by: Krzysztof Kozlowski Signed-off-by: Haritha S K Signed-off-by: Daniel Lezcano Link: https://patch.msgid.link/20260619-b4-maili-upstream-3-v2-1-e54516c37022@oss.qualcomm.com --- Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + 1 file changed, 1 insertion(+) diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index f0efaa8349ee..5a8f7673e730 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml @@ -58,6 +58,7 @@ properties: - qcom,glymur-tsens - qcom,hawi-tsens - qcom,kaanapali-tsens + - qcom,maili-tsens - qcom,milos-tsens - qcom,nord-tsens - qcom,msm8953-tsens